DALLAS--(BUSINESS WIRE)--May. 21, 2009-- Diodes Incorporated (Nasdaq:DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete and analog semiconductor markets, today announced a range of four H-Bridge MOSFET packages that are set to dramatically simplify DC fan and Cold Cathode Fluorescent Lamp (CCFL) inverter circuits by reducing both component count and PCB size in space constrained applications.

Two 30V H-Bridges, the ZXMHC3A01N8 and ZXMHC3F381N8, are well-suited for 12V DC fan and inverter applications and offer users a choice of low R_DS(ON) performance. The 60V rated ZXMHC6A07N8 and 100V rated ZXMHC10A07N8 are industry firsts and are targeted at 24V DC and 48V DC motor control circuits, respectively.

Featuring dual complementary pairs of N- and P-type MOSFETs in an SO8 package, the ZXMHC parts can replace either four discrete SOT23 packaged MOSFETs or two SO8 complementary MOSFET packages. The proprietary packaging enables significant reductions in the PCB footprint by at least 50% and in overall inventory cost for a wide range of existing motor or other inductive load drives.

About Diodes Incorporated

Diodes Incorporated (Nasdaq:DIOD), an S&P SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete and analog semiconductor markets, serving the consumer electronics, computing, communications, industrial and automotive markets. Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, amplifiers and comparators, Hall-effect sensors and temperature sensors, power management devices including LED drivers, DC-DC switching regulators, linear voltage regulators and voltage references, along with special function devices including USB power switch, load switch, voltage supervisor and motor controllers. The Company’s corporate headquarters are located in Dallas, Texas. A sales, marketing, engineering and logistics office is located in Westlake Village, California. Design centers are located in Dallas; San Jose, California; Taipei, Taiwan; Manchester, England and Neuhaus, Germany. The Company’s wafer fabrication facilities are located in Kansas City, Missouri and Manchester; with two manufacturing facilities located in Shanghai, China, another in Neuhaus, and a joint venture facility located in Chengdu, China. Additional engineering, sales, warehouse and logistics offices are located in Taipei; Hong Kong; Manchester and Munich, Germany, with support offices located throughout the world. For further information, including SEC filings, visit the Company's website at http://www.diodes.com.

Source: Diodes Incorporated

Diodes Incorporated
Francis Tang, VP Product Development
972-385-2810
pressinquiries@diodes.com
or
Shelton Group
Leanne K. Sievers, EVP, Investor Relations
949-224-3874
lsievers@sheltongroup.com