DFN1212-3 Packaged Parts are Drop-in Replacement for SOT723
Alternatives
PLANO, Texas--(BUSINESS WIRE)--Dec. 1, 2011--
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and
supplier of high-quality application specific standard products within
the broad discrete, logic and analog semiconductor markets, today
announced the introduction of its first MOSFETs to be housed in the
miniature DFN1212-3 package. With a junction to ambient thermal
resistance (Rthj-a) of 130ºC/W, the package supports a power dissipation
of up to 1W under continuous conditions, ensuring significantly cooler
operation than that achievable with existing footprint-compatible SOT723
alternatives characterized by an Rthj-a performance of 280ºC/W.
Occupying the exact same 1.44mm2 printed circuit board area
and with the same low profile 0.5mm off-board height as the less
thermally efficient SOT723 packaged MOSFETs, these leadless DFN1212-3
packaged alternatives are drop-in replacements for high reliability
signal and load-switching applications in a broad range of high
portability consumer electronics products including digital cameras,
tablet PCs and smartphones.
The MOSFET pair initially released by Diodes Incorporated are 20V rated
and comprise the DMN2300UFD N-channel and the DMP21D0UFD P-channel
parts. Helping to dramatically reduce conduction losses and power
dissipation, the N-channel MOSFET presents a typical RDS(ON) of
just 400mΩ at VGS of 1.8V, which is approximately 50% lower
than the most popular SOT723 packaged alternatives. For further
information, visit the Company’s website at www.diodes.com.
About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600
and Russell 3000 Index company, is a leading global manufacturer and
supplier of high-quality application specific standard products within
the broad discrete, logic and analog semiconductor markets. Diodes
serves the consumer electronics, computing, communications, industrial,
and automotive markets. Diodes' products include diodes, rectifiers,
transistors, MOSFETs, protection devices, functional specific arrays,
single gate logic, amplifiers and comparators, Hall-effect and
temperature sensors; power management devices, including LED drivers,
DC-DC switching and linear voltage regulators, and voltage references
along with special function devices, such as USB power switches, load
switches, voltage supervisors, and motor controllers. The Company's
corporate headquarters, logistics center, and Americas' sales office are
located in Plano, Texas. Design, marketing, and engineering centers are
located in Plano; San Jose, California; Taipei, Taiwan; Manchester,
England; and Neuhaus, Germany. The Company's wafer fabrication
facilities are located in Kansas City, Missouri and Manchester, with two
manufacturing facilities located in Shanghai, China, another in Neuhaus,
and two joint venture facilities located in Chengdu, China. Additional
engineering, sales, warehouse, and logistics offices are located in Fort
Worth, Texas; Taipei; Hong Kong; Manchester; and Munich, Germany, with
support offices located throughout the world. For further information,
including SEC filings, visit the Company's website at http://www.diodes.com.
Source: Diodes Incorporated
Company Contact:
Diodes Incorporated
Francis Tang
VP,
Worldwide Discrete Products
P: 972-987-3900
E: pressinquiries@diodes.com
or
Investor
Relations Contact:
Shelton Group
Leanne K. Sievers
EVP,
Investor Relations
P: 949-224-3874
E: lsievers@sheltongroup.com