UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
WASHINGTON, D.C. 20549
FORM
CURRENT REPORT
Pursuant to Section 13 or 15(d) of
the Securities Exchange Act of 1934
Date of Report (Date of earliest event reported):
DIODES INCORPORATED
(Exact name of Registrant as Specified in Its Charter)
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(State or Other Jurisdiction |
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(IRS Employer |
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(Address of Principal Executive Offices)
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Registrant’s Telephone Number, Including Area Code: (
Not Applicable
(Former Name or Former Address, if Changed Since Last Report)
Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions (see General Instructions A.2. below):
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Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) |
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Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) |
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Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) |
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Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c)) |
Securities registered pursuant to Section 12(b) of the Act:
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Trading Symbol(s) |
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Name of each exchange on which registered |
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Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405 of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).
Emerging growth company
If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐
Item 1.01 Entry into a Material Definitive Agreement.
On August 8, 2019, Diodes Incorporated (the “Company”) and Lite-On Semiconductor Corporation (“LSC”), a Taiwan-based supplier of “green” power-related discrete and analog semiconductor devices, announced they had entered into a Share Swap Agreement that provides for the acquisition of LSC by the Company (the “Agreement”). LSC is publicly listed on the Taiwan Stock Exchange, stock code 5305. A copy of the Agreement is attached as Exhibit 2.1 to the Report.
At the effective date of the transaction, each share of LSC stock will be converted into the right to receive TWD 42.50 in cash, or $1.37 USD as of June 30, 2019, without interest. The aggregate consideration will be approximately $428 million. The price per share reflects a premium of 35% over LSC’s 30-day volume-weighted average price. The boards of directors of both companies have approved the transaction, which is still subject to approval by LSC shareholders as well as other customary closing conditions and regulatory approvals. The transaction is expected to close during the second quarter of 2020.
The Company plans to fund the purchase price of the acquisition primarily with proceeds from a new financing agreement being arranged.
The foregoing description of the Agreement and the transactions contemplated thereby does not purport to be complete and is qualified in its entirety by reference to the Agreement, a copy of which is filed as Exhibit 2.1 hereto and is hereby incorporated into this report by reference. The Agreement has been included to provide investors with information regarding its terms. It is not intended to provide any other factual information about the Company. In particular, the assertions embodied in the representations and warranties contained in the Agreement are subject to qualifications and limitations agreed to by the respective parties in connection with negotiating the terms of the Agreement, including information contained in any confidential disclosure schedules provided by the Company and LSC in connection with the signing of the Agreement. Moreover, certain representations and warranties in the Agreement were used for the purpose of allocating risk between the Company and LSC rather than establishing matters as facts. Accordingly, you should not rely on the representations and warranties in the Agreement as characterizations of the actual state of facts about the Company
Item 7.01 Regulation FD Disclosure.
On August 8, 2019, the Company issued a press release announcing the Company and LSC have entered into the Agreement. A copy of the press release is attached as Exhibit 99.1. The Company held a conference call to discuss the acquisition of LSC on August 8, 2019 at 4:00 p.m. Central Time (5:00 p.m. Eastern Time). For further information concerning the conference call, see the press release attached as Exhibit 99.1 to this Report. A recording of the conference call will be posted on the Company’s website at www.diodes.com shortly after the call. A copy of the script for the call and presentation slides, are attached as Exhibit 99.2 and 99.3, respectively, to this Report. The information furnished in this Item 7.01, including exhibits 99.1, 99.2 and 99.3, will not be treated as “filed” for the purposes of Section 18 of the Exchange Act, or otherwise subject to the liabilities of that section. This information will not be deemed incorporated by reference into any filing under the Securities Act, or into another filing under the Exchange Act, unless that filing expressly refers to specific information in this Report.
Cautionary Information Regarding Forward-Looking Statements
Except for the historical and factual information contained in the press release and script attached as Exhibits 99.1, 99.2 and 99.3, any statements set forth herein that are not historical facts are forward-looking statements that involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Such forward-looking statements include, but are not limited to, the following: the expected benefits of the acquisition, including the acquisition being immediately accretive; the efficiencies, cost savings, revenues, and enhanced product offerings, market position, and design and manufacturing capabilities of Diodes after the acquisition; and other statements identified by words such as “estimates,” “expects,” “projects,” “plans,” “will,” and similar expressions.
Potential risks and uncertainties include, but are not limited to, such factors as: the possibility that the transaction may not be consummated, including as a result of any of the conditions precedent; the risk of superior acquisition proposal from other parties; the risk of Diodes being unable to obtain sufficient financing from lenders to complete the acquisition; the risk of global market downturn conditions and volatilities impacting the completion of the acquisition or the funding; the risk that such expectations may not be met; the risk that the expected benefits of the acquisition may not be realized or that integration of the acquired business may not be as rapid as we anticipate; the risk that LSC’s business will not be integrated successfully into Diodes’; the risk that the expected benefits of the acquisition may not be realized, including the realization of the accretive effect of the acquisition; the risk that LSC’s standards, procedures, and controls will not be brought into conformance within Diodes’ operation; difficulties coordinating Diodes’ and LSC’s new product and process development, hiring additional management and other critical personnel, and increasing the scope, geographic diversity, and complexity of Diodes’ operations; difficulties in consolidating facilities and transferring processes and know-how; difficulties in reducing the cost of LSC’s business; the diversion of our management’s attention from the management of our business; Diodes may not be able to maintain its current growth strategy or continue to maintain its current performance, costs, and loadings in its manufacturing facilities; risks of domestic and foreign operations, including excessive operation costs, labor shortages, higher tax rates, and Diodes’ joint venture prospects; the risk that we may not be able to increase our automotive, industrial, or other revenue and market share; the risks of cyclical downturns in the semiconductor industry and of changes in end-market demand or product mix that may affect gross margin or render inventory obsolete; the risk that our future outlook or guidance may be incorrect; unfavorable currency exchange rates; the risks of global economic weakness or instability in global financial markets; the
risks of trade restrictions, tariffs, or embargoes; the risk of breaches of our information technology systems; and other information, including the “Risk Factors” detailed from time to time in Diodes’ filings with the United States Securities and Exchange Commission. You should not place undue reliance on these forward-looking statements, which speak only as of the date of the press release. The Company undertakes no obligation to update publicly any forward-looking statements, whether as a result of new information, future events or otherwise.
Item 9.01. Financial Statements and Exhibits.
(d) Exhibits.
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Exhibit No. |
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Description |
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2.1 |
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Share Swap Agreement between Diodes Incorporated and Lite-On Semiconductor Corporation |
99.1 |
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99.2 |
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99.3 |
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SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized.
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Dated: August 8, 2019 |
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DIODES INCORPORATED |
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By |
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/s/ Brett R. Whitmire |
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Brett R. Whitmire |
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Chief Financial Officer |
Exhibit 2.1
EXECUTION
SHARE SWAP AGREEMENT
between
DIODES INCORPORATED
and
LITE-ON SEMICONDUCTOR CORP.
Dated as of August 8, 2019
Article I DEFINITIONS |
2 |
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Section 1.1 |
Certain Definitions |
2 |
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Section 1.2 |
Interpretation |
8 |
Article II SHARE SWAP |
9 |
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Section 2.1 |
Share Swap |
9 |
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Section 2.2 |
Closing |
9 |
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Section 2.3 |
Effects of Share Swap |
9 |
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Section 2.4 |
Articles of Incorporation; Share Capital |
9 |
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Section 2.5 |
Directors and Supervisors |
10 |
Article III CONSIDERATION; PAYMENT |
10 |
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Section 3.1 |
Consideration |
10 |
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Section 3.2 |
Share Swap Entity of Buyer. |
10 |
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Section 3.3 |
Payment |
10 |
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Section 3.4 |
Withholding Rights |
11 |
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Section 3.5 |
Fractional Shares |
11 |
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Section 3.6 |
Dissenting Shares |
11 |
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Section 3.7 |
Adjustment of Consideration |
12 |
Article IV REPRESENTATIONS AND WARRANTIES OF THE COMPANY |
13 |
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Section 4.1 |
Organization, Standing and Power |
13 |
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Section 4.2 |
Subsidiaries |
13 |
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Section 4.3 |
Capital Stock |
13 |
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Section 4.4 |
Authority |
14 |
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Section 4.5 |
No Conflict |
15 |
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Section 4.6 |
Consents |
15 |
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Section 4.7 |
Certain Information |
15 |
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Section 4.8 |
No Undisclosed Liabilities |
16 |
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Section 4.9 |
Absence of Certain Changes |
16 |
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Section 4.10 |
Compliance with Laws; Permits |
16 |
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Section 4.11 |
Legal Proceedings; Orders |
16 |
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Section 4.12 |
Certain Business Practices |
17 |
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Section 4.13 |
Restrictions on Business Activities |
17 |
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Section 4.14 |
Contracts and Commitments |
17 |
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Section 4.15 |
Tax Matters |
19 |
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Section 4.16 |
Employee Benefit Plans; Employment and Labor Matters |
20 |
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Section 4.17 |
Intellectual Property |
21 |
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Section 4.18 |
IT Systems |
22 |
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Section 4.19 |
Personal Information |
22 |
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Section 4.20 |
Real Property |
22 |
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Section 4.21 |
Environmental Matters |
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Section 4.22 |
Insurance |
24 |
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Section 4.23 |
Significant Customers |
24 |
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Section 4.24 |
Significant Suppliers |
24 |
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Section 4.25 |
Books and Records |
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Section 4.26 |
No Broker |
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Article V REPRESENTATIONS AND WARRANTIES OF BUYER |
24 |
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Section 5.1 |
Organization, Standing and Power |
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Section 5.2 |
Authority |
25 |
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Section 5.3 |
No Conflict |
25 |
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Section 5.4 |
Consents |
25 |
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Section 5.5 |
Financial Ability of Buyer and TaiCo |
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Section 5.6 |
Ownership of TaiCo |
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Section 5.7 |
No Broker |
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Article VI COVENANTS |
26 |
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Section 6.1 |
Conduct of Business of the Company Pending the Share Swap |
26 |
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Section 6.2 |
Acquisition Proposals |
28 |
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Section 6.3 |
Access to Information |
28 |
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Section 6.4 |
Confidentiality |
28 |
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Section 6.5 |
Company Shareholders Meeting; Governance Matters |
29 |
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Section 6.6 |
Further Actions |
29 |
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Section 6.7 |
Regulatory Approval and Antitrust Law Filings |
29 |
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Section 6.8 |
Public Announcements |
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Section 6.9 |
Notification of Certain Matters |
31 |
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Section 6.10 |
Banking Chops |
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Article VII CONDITIONS TO CLOSING |
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Section 7.1 |
Conditions to Each Party’s Obligations to Effect the Share Swap |
31 |
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Section 7.2 |
Conditions to Buyer’s Obligations to Effect the Share Swap |
32 |
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Section 7.3 |
Conditions to the Company’s Obligations to Effect the Share Swap |
33 |
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Section 7.4 |
Satisfaction and Waiver of Conditions to Closing |
33 |
Article VIII TERMINATION, AMENDMENT AND WAIVER |
33 |
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Section 8.1 |
Termination |
33 |
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Section 8.2 |
Effect of Termination |
34 |
Article IX GENERAL PROVISIONS |
34 |
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Section 9.1 |
Entire Agreement |
34 |
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Section 9.2 |
Severability |
34 |
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Section 9.3 |
Notices |
35 |
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Section 9.4 |
Amendment or Supplement |
35 |
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Section 9.5 |
Extension of Time; Waiver |
35 |
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Section 9.6 |
No Rollover |
36 |
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Section 9.7 |
Successors and Assigns |
36 |
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Section 9.8 |
Rights Cumulative |
36 |
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Section 9.9 |
Governing Law |
36 |
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Section 9.10 |
Dispute Resolution |
36 |
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Section 9.11 |
Expenses |
37 |
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Section 9.12 |
Currency |
37 |
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Section 9.13 |
Counterparts |
37 |
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Section 9.14 |
Delivery by Electronic Transmission |
37 |
Exhibit AShare Capital on Share Swap Record Date
Exhibit BThird Party Consents of the Company
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THIS SHARE SWAP AGREEMENT (this “Agreement”), dated as of August 8, 2019 (the “Effective Date”), is being entered into by and between:
A. |
Diodes Incorporated, a company incorporated and in existence under the laws of the State of Delaware, USA and having its principal place of business at 4949 Hedgcoxe Rd., Suite 200, Plano, Texas, USA (“Buyer”); and |
B. |
Lite-On Semiconductor Corp., a company incorporated and in existence under the laws of Taiwan with uniform commercial number of 23528103 and having its registered address at 4F. No. 392, Ruiguang Rd., Neihu Dist., Taipei, Taiwan (the “Company”). |
Buyer and the Company are hereinafter collectively referred to as the “Parties” and each separately as a “Party”.
RECITALS
WHEREAS, Buyer intends to implement a 100% share swap pursuant to Article 29 of the Taiwan Mergers and Acquisitions Act (the “M&A Act”) with the Company, whereby Buyer will designate a wholly-owned Subsidiary to acquire 100% of the issued and outstanding capital shares of the Company (the “Shares”) for such consideration as further described herein and on the terms and subject to the conditions set forth herein (the “Share Swap”), the Shares will be delisted from the TSE upon the Share Swap Record Date and, following the Share Swap Record Date, the public reporting status of the Company will be withdrawn;
WHEREAS, the Board of Directors of Buyer has approved the execution, delivery and performance by Buyer of this Agreement and the consummation of the transactions contemplated herein;
WHEREAS, each of the Special Committee of the Company and the Board of Directors of the Company (the “Company Board”) has determined that the transactions contemplated herein are fair to the Company and its shareholders (the “Company Board Determination”), and the Company Board has approved the execution, delivery and performance by the Company of this Agreement and the consummation of the transactions contemplated hereby, including the Share Swap, subject to the approval of the shareholders of the Company (the “Company Shareholders”); and
WHEREAS, as soon as possible after the Effective Date, an extraordinary shareholders meeting (the “Company Shareholders Meeting”) will be convened by the Company to request the approval of the Share Swap from the Company Shareholders.
AGREEMENT
NOW, THEREFORE, in consideration of the mutual covenants contained herein and other good and valuable consideration, the receipt and sufficiency of which are hereby acknowledged, the Parties agree as follows:
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Section 1.1Certain Definitions
. For purposes of this Agreement:
“Acquisition Proposal” means any proposal, offer or inquiry (whether or not in writing) from any Person or group relating to any (i) acquisition, transfer, lease or license of assets of the Company Group equal to 20% or more of the Company’s consolidated assets, (ii) issuance or acquisition of 20% or more of the outstanding equity securities of the Company (or the issuance or acquisition of other securities convertible into or exchangeable for equity securities of the Company representing 20% or more of the outstanding equity securities of the Company), (iii) tender offer or exchange offer that if consummated would result in any person, entity or group beneficially owning 20% or more of the outstanding equity securities of the Company, (iv) merger, consolidation, amalgamation, share swap, share exchange, business combination, recapitalization, or similar transaction involving the Company or (v) joint venture, liquidation, dissolution or similar transaction that involves 20% or more of the consolidated assets, revenues or earnings of the Company.
“Affiliate” means, with respect to any Person, any other Person that, at the time of determination, directly or indirectly, through one or more intermediaries, controls, is controlled by or is under common control with, such first Person.
“Assets” means all of the assets and properties of the Company Group.
“Building Permits” mean all permits, licenses, easements, variances, exemptions, consents, certificates, authorizations, registrations, Orders and other approvals from Governmental Entities necessary for, or issued to, build, construct, maintain, demolish, remodel, refurbish and/or occupy any structures, buildings, infrastructure or utilities (or appurtenances thereto) relating to any Real Property.
“Business Day” means any day other than a Saturday, a Sunday or a day on which banks in Plano, Texas, USA or Taipei, Taiwan are authorized by Law or executed Order to be closed.
“Company Disclosure Letter” means a letter of even date hereof from the Company to Buyer, together with the schedules thereto, disclosing certain facts and circumstances in relation to the Company, subject to which the representations and warranties of the Company in Article IV of this Agreement are given.
“Company Employee Plan” means any plan, program, policy, practice, Contract or other arrangement providing for any bonus, compensation, severance, separation, termination pay, deferred compensation, management, employment, contractor or consulting services, incentive compensation, relocation, performance awards, stock or stock related awards, vacation, repatriation, expatriation, loans, visas, work permits, retention pay, change of control, disability, death benefit, retirement benefits, pension benefits, welfare benefits, hospitalization or insurance plan, fringe benefits or other employee benefits or remuneration of any kind, whether written, unwritten or otherwise, funded or unfunded, including, but not limited to, each employee benefit plan which is or has been maintained, contributed to, or required to be contributed to, by the Company Group for the benefit of any current or former employee of the Company Group, or with respect to which the Company Group has or may have any liability or obligation.
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“Company Equity Plans” means any employee, consultant, representative or director stock option, stock purchase or equity compensation plan, arrangement or agreement of the Company Group.
“Company Group” means the Company and its Subsidiaries set forth in Section 4.2(a) of the Company Disclosure Letter.
“Company Intellectual Property Rights” means any and all Intellectual Property Rights that are owned, used, held for use or practiced by the Company Group.
“Company Products” means all products, technologies and services developed (including products, technologies and services under development), made, provided, distributed or sold by the Company Group.
“Company Public Reports” means reports and other documents required to be filed with the FSC, stated in the Company’s annual report or publicly disclosed at the Market Observation Post System by the Company since January 1, 2017.
“Confidentiality Agreement” means the Confidentiality Agreement entered into by and amongst Buyer, the Company and Lite-On Technology Corp. as of July 4, 2019.
“Contract” means any instrument, contract, purchase order, agreement or other similar legally binding commitment or undertaking of any nature, whether written or oral.
“control” (including the terms “controlled,” “controlled by” and “under common control with”) means the possession, directly or indirectly or as trustee or executor, of the power to direct or cause the direction of the management policies of a Person, whether through the ownership of stock, as trustee or executor, by contract or credit arrangement or otherwise.
“Copyrights” means copyrights and mask work rights (whether or not registered) and registrations and applications therefor, worldwide.
“Environmental Law” means any applicable Law, and any Order or binding agreement with any Governmental Entity: (i) relating to pollution (or the cleanup thereof) or the protection of natural resources, endangered or threatened species, human health or safety, or the environment (including ambient air, soil, surface water or groundwater or subsurface strata); or (ii) concerning the presence of, exposure to, or the management, manufacture, use, containment, storage, recycling, reclamation, reuse, treatment, generation, discharge, transportation, processing, production, disposal or remediation of any Hazardous Substances.
“Environmental Permit” is any Permit required to be obtained from any Governmental Entity with respect to a Hazardous Substances Activity which is or was conducted by the Company Group.
“FSC” means the Financial Supervisory Commission of Taiwan.
“GAAP” means, with respect to any Person, generally accepted accounting principles in the jurisdiction in which such Person is domiciled in effect from time to time.
“Governmental Entity” means any court, administrative agency or commission or other governmental authority or instrumentality of any country or political territory with competent jurisdiction over the party and matter in question.
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“Hazardous Substances” means (i) any material, substance, chemical, waste, product, derivative, compound, mixture, solid, liquid, mineral or gas, in each case, whether naturally occurring or manmade, that is hazardous, acutely hazardous, toxic, or words of similar import or regulatory effect under Environmental Laws; and (ii) any petroleum or petroleum-derived products, radon, radioactive materials or wastes, asbestos in any form, lead or lead-containing materials, urea formaldehyde foam insulation and polychlorinated biphenyls.
“Hazardous Substances Activities” means the transportation, transfer, recycling, storage, use, treatment, manufacture, removal, remediation, release, exposure of others to, sale or distribution of any Hazardous Substances or any product or waste containing a Hazardous Substance, or product manufactured with ozone depleting substances, including, without limitation, any required labeling, payment of waste fees or charges (including so-called e-waste fees) and compliance with any product take-back or product content requirements.
“IFRS” means the International Financial Reporting Standards as endorsed by the FSC.
“Intellectual Property Rights” means intellectual property rights arising from or in respect of the following, whether protected, created or arising under the Laws of any jurisdiction (where applicable): Copyrights, Trade Secrets, Patents and Trademarks and analogous rights, including moral and economic rights of authors and inventors (however denominated) and including the right to enforce and recover damages for the infringement or misappropriation of any of the foregoing.
“IT Systems” means the computer, information technology and data processing systems, facilities and services used by the Company Group in the operation of their businesses.
“Law” or “Laws” mean any laws, statutes, rules, regulations, ordinances, orders and codes issued, enacted, adopted, promulgated, implemented or otherwise put into effect by or under any Governmental Entity.
“Legal Proceeding” means any action, claim, suit, litigation, proceeding (public or private), criminal prosecution, arbitration, appeal, mediation, conciliation, consent decree, audit or investigation by or before any Governmental Entity.
“Liability” means any liability, obligation or commitment of any kind, whether absolute, accrued, fixed or floating, matured or unmatured, determined or determinable or otherwise and whether or not required to be recorded or reflected on a balance sheet prepared in accordance with GAAP of Taiwan or Taiwan IFRS, as applicable, and “Liabilities” shall be construed accordingly.
“Lien” means any charge, mortgage, lien (statutory or otherwise), power of sale, hypothecation, usufruct, retention of title, right of preemption, encroachment, pledge, hypothecation, security interest, attachment, levy, encumbrance or other similar restriction of any kind on ownership or use, or any agreement or Contract to create any of the foregoing.
“Material Adverse Effect” means any Change that, individually or when taken together with all other such Changes that exist at the date of determination of the occurrence of a Material Adverse Effect,
(i) has or results in a material adverse effect on the business, Assets, Liabilities, financial condition or results of operations of the Company Group taken as a whole; provided, however, that no Changes resulting from, relating to or arising out of the following (by
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themselves or when aggregated with any other Changes) shall be taken into account when determining whether a Material Adverse Effect has occurred:
(A)any change in general economic, financial, business or political conditions or industry-wide (including but not limited to those affecting the securities markets or changes in interest rates or exchange rates);
(B)changes in applicable Law, GAAP or IFRS applicable to the Company Group, as the case may be;
(C)any acts of terrorism, major armed hostilities or war;
(D)any major natural disasters;
(E)any action required to be taken in connection with this Agreement or the failure to take any action that is expressly prohibited by this Agreement;
(F)with respect to the Company Group only, the buy-back of any Dissenting Shares; or
(G)any change directly attributable to the public announcement of the Share Swap or this Agreement,
in the case of each of (A), (C) or (D) above, to the extent that such conditions do not have a materially disproportionate impact on the Company Group, taken as a whole, relative to other companies of similar nature and comparable size; or
(ii) prevents or materially impedes, interferes with, hinders or delays the performance by the Company of its obligations under this Agreement or the consummation of its obligations under this Agreement, the Share Swap, or the other transactions contemplated hereby.
“Order” means any writ, judgment, decree, award, ruling, injunction, directive or similar order of any Governmental Entity, and any award or order of any arbitrator to the extent enforceable by a Governmental Entity, in each case whether preliminary or final.
“Ordinary Course of Business” means the ordinary course of business, consistent with past custom and practice, including with regard to nature, frequency, and magnitude.
“Organizational Documents” means (i) the certificate of incorporation, articles of association and the bylaws of a corporation, (ii) any charter or similar document adopted or filed in connection with the creation, formation or organization of a Person and (iii) any amendment to or restatement of any of the foregoing, as applicable.
“Patents” means any patents and patent applications, together with all reissuances, divisionals, continuations, continuations-in-part, revisions, renewals, extensions, and reexaminations thereof, and any identified invention disclosures.
“Permit” means any licenses, permits, approvals, registrations, authorizations, franchises, certifications, variances, exemptions, consents, orders and qualification filings with, of or from a Governmental Entity.
“Permitted Liens” means, with respect to any Real Property, (i) Liens for Taxes and other similar governmental charges and assessments which are not yet due, (ii) Liens of landlords
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and liens of carriers, warehousemen, mechanics and materialmen and other like Liens arising in the Ordinary Course of Business consistent with past practice for sums not yet due, or other liens securing the performance of bids, trade contracts, lease or statutory obligations (including workers’ compensation, unemployment insurance or other social security legislation) and (iii) security given in the Ordinary Course of Business to any public utility, Governmental Entity or other statutory or public authority having jurisdiction over the Company.
“Person” means an individual, corporation, partnership, limited liability company, association, trust or other entity or organization, including any Governmental Entity.
“Personal Information” means, in addition to all information defined or described as “personal information,” “personally identifiable information,” “PII,” or similar term in any privacy policy or other public-facing statement of the Company Group, all information regarding or capable of being associated with an individual consumer or device, including: (i) information that identifies, could be used to identify or is otherwise identifiable with an individual or a device, including name, physical address, telephone number, email address, financial account number, government-issued identifier (including social security number and driver’s license number), medical, health or insurance information, gender, date of birth, educational or employment information, religious or political views or affiliations, marital or other status, photograph, face geometry or biometric information, and any other data used or intended to be used to identify, contact or precisely locate an individual; (ii) any data regarding an individual’s activities online or on a mobile device or other application (e.g., searches conducted, web pages or content visited or viewed) associated with an identifiable individual; and (iii) internet protocol addresses or other persistent identifiers. Personal Information may relate to any individual, including users of internet and device applications who view or interact with the Company, or a current, prospective or former customer, employee or vendor of any Person. Personal Information includes information in any form, including paper, electronic and other forms.
“Registered Intellectual Property” means Patents, registered Copyrights and pending applications thereof, and Trademarks.
“Regulatory Approvals” means (i) approval by the Investment Commission of the Ministry of Economic Affairs of Taiwan for the Share Swap, (ii) consent from the Central Bank of China for the foreign exchange transactions necessary to convert foreign currency into New Taiwan Dollars for payment of the Payment Fund, (iii) consent from the TSE for the delisting of the Company and (iv) consent from the FSC to cancel the Company’s status as a public company.
“Subsidiary” means, with respect to any Person, any other Person of which stock or other equity interests having ordinary voting power to elect more than fifty percent (50%) of the board of directors or other governing body are owned, directly or indirectly, by (i) such first Person, (ii) such first Person and one or more of its Subsidiaries or (iii) one or more Subsidiaries of such first Person. For the avoidance of doubt, Subsidiaries of the Company do not include On-Bright Electronics Incorporated and its Subsidiaries.
“Taiwan” means the Republic of China.
“Tax” or, collectively, “Taxes” means (i) any and all taxes, assessments and other similar charges, withholdings, duties, impositions, installments and Liabilities imposed by or payable to any Governmental Entity, including taxes based upon or measured by gross receipts,
6
income, profits, sales, use and occupation, capital and value added, goods and services, ad valorem, transfer (including real estate transfer), franchise, withholding, payroll, recapture, employment, excise and property taxes as well as public imposts, fees and social security charges (including health, unemployment, workers’ compensation and pension insurance), together with all interest, penalties and additions imposed with respect to such amounts, (ii) any Liability for the payment of any amounts of the type described in clause (i) above as a result of being or having been a member of an affiliated, consolidated, combined, unitary, fiscal unity or similar group for any period, and (iii) any Liability for the payment of any amounts of the type described in clauses (i) or (ii) above as a result of any express or implied obligation to indemnify any other Person or as a result of any obligation under any agreement or arrangement with any other Person with respect to such amounts and including any Liability for taxes of a predecessor or transferor or otherwise by operation of Law.
“Tax Relief” means any allowance, credit, deduction, exemption or set-off in respect of any Tax or relevant to the computation of any income, profits or gains for the purposes of any Tax, or any repayment of or saving of Tax (including any repayment supplement or interest in respect of Tax), and any reference to the use or set off of Tax Relief shall be construed accordingly and shall include use or set off in part and any reference to the loss of a Tax Relief shall include the absence, non-existence or cancellation of any such Tax Relief, or to such Tax Relief being available only in a reduced amount.
“Tax Returns” means returns, estimates, amendments, information statements, elections, forms, and any attachments, appendices or addenda thereto relating to any and all Taxes.
“to the knowledge of the Company” means the knowledge of the directors and/or C-level executives of the Company and matters that any of such Persons should have known after reasonable inquiry.
“Trade Secrets” means confidential know-how, inventions, discoveries, concepts, ideas, methods, processes, designs, formulae, technical data, source code, drawings, specifications (including logic specifications), data bases, data sheets, customer lists, customer data and other confidential information that constitute trade secrets under applicable Law, in each case excluding any rights in respect of any of the foregoing that comprise Copyrights.
“Trademarks” means trademarks and registrations and applications therefor.
“TSE” means Taiwan Stock Exchange Corp.
“USA” means the United States of America.
In addition to the terms defined above, the terms listed below are defined in the sections set forth opposite such defined term.
Agreement |
Preamble |
Antitrust Laws |
Section 4.6 |
Appraisal |
Section 3.6 |
Arbitrable Dispute |
Section 9.10(a) |
Books and Records |
Section 4.25 |
Buyer |
Preamble |
CAA |
Section 9.10(b) |
Closing |
Section 2.2 |
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Company Act |
Section 3.6 |
Company Balance Sheet |
Section 4.8 |
Company Board |
Recitals |
Company Board Determination |
Recitals |
Company Disclosure Letter |
Article IV |
Company Financial Statements |
Section 4.7(b) |
Company IP Licenses |
Section 4.17(g) |
Company Permits |
Section 4.10(c) |
Company Registered Intellectual Property |
Section 4.17(e) |
Company Shareholders |
Recitals |
Company Shareholders Approval |
Section 4.4 |
Company Shareholders Meeting |
Recitals |
Consideration |
Section 3.1(a) |
Condition to Closing |
Section 7.4 |
Dissenting Shareholder |
Section 3.6 |
Dissenting SharesSection 3.6
Effective Date |
Preamble |
Filing PartySection 6.6(c)
Lease AgreementsSection 4.20(b)
Leased Real PropertySection 4.20(b)
Material ContractsSection 4.14(a)
M&A ActRecitals
NotificationSection 6.5(a)
Outside DateSection 8.1(e)
Owned Real PropertySection 4.20(a)
Party / PartiesPreamble
Payment FundSection 3.3(a)
Pre-Closing PeriodSection 6.1(a)
Real PropertySection 4.20(b)
RepresentativesSection 6.2(b)
Share SwapRecitals
Share Swap Record DateSection 2.2
SharesRecitals
Significant CustomersSection 4.23
Significant SupplierSection 4.24
Stock AgentSection 3.3(a)
TaiCoSection 3.2(a)
. When a reference is made in this Agreement to a Section, Article or Exhibit, such reference shall be to a Section, Article or Exhibit of this Agreement unless otherwise indicated. The table of contents and headings contained in this Agreement or in any Exhibit are for convenience of reference purposes only and shall not affect in any way the meaning or interpretation of this Agreement. All words used in this Agreement will be construed to be of such gender or number as the circumstances require. Any capitalized terms used in any Exhibit but not otherwise defined therein shall have the meaning set forth in this Agreement. All Exhibits annexed hereto or referred to herein are hereby incorporated in and made a part of this Agreement as if set forth herein unless otherwise indicated. The words “include,” “includes” and “including” and words of similar import when used in this Agreement will mean “include, without limitation,” “includes,
8
without limitation” or “including, without limitation,” unless otherwise specified. The words “hereof,” “herein” and “hereunder” and words of like import used in this Agreement shall refer to this Agreement as a whole and not to any particular provision of this Agreement. The term “or” is not exclusive and has the meaning represented by the phrase “and/or.” The word “extent” in the phrase “to the extent” means the degree to which a subject or other theory extends and such phrase shall not mean “if.” Reference herein to “default under,” “violation of” or other expression of similar import shall be deemed to be followed by the phrase “with or without notice or lapse of time, or both.” All references to time shall refer to Taiwan time and references to “months” and “years” shall refer to the Gregorian calendar. When calculating the period of time before which, within which or following which any act is to be done or step taken pursuant to this Agreement, the date that is the reference date in calculating such period will be excluded. If the last day of such period is a non-Business Day, the period in question will end on the next succeeding Business Day. Any agreement or instrument defined or referred to herein, or in any agreement or instrument that is referred to herein, means such agreement or instrument as from time to time amended, modified or supplemented in accordance with such agreement’s or instrument’s terms. The Parties have participated jointly in the negotiation and drafting of this Agreement. In the event an ambiguity or question of intent or interpretation arises, this Agreement shall be construed as if drafted jointly by the Parties and no presumption or burden of proof shall arise favoring or disfavoring any Party by virtue of the authorship of any provisions of this Agreement.
. Upon the terms and subject to the satisfaction or, to the extent permitted by applicable Law, waiver of the conditions set forth in this Agreement and in accordance with applicable Law, at the Share Swap Record Date, the Company shall be acquired by Buyer to become a wholly-owned Subsidiary of Buyer.
. The closing of the Share Swap (the “Closing”) shall take place as soon as practicable but in no event later than five (5) Business Days following the satisfaction or, to the extent permitted by applicable Law, waiver of the conditions set forth in Article VII (other than those conditions that by their terms are to be satisfied at the Closing, but subject to the satisfaction or, to the extent permitted by applicable Law, waiver of those conditions), at the offices of Jones Day at 8F, No. 2 Dunhua S. Rd., Sec. 2, Taipei, unless another date, time or place is agreed to in writing by Buyer and the Company. The date on which the Closing occurs is referred to in this Agreement as the “Share Swap Record Date”. Subject to all terms and conditions contained in this Agreement, the Parties tentatively expect the Share Swap Record Date to occur on or around April 1, 2020.
Section 2.3Effects of Share Swap
. The Share Swap shall have the effects set forth in this Agreement and in the relevant provisions of applicable Law, including the M&A Act.
Section 2.4Articles of Incorporation; Share Capital
.
(a) |
Following the designation of TaiCo by Buyer in accordance with Section 3.2 hereof, Buyer shall cause TaiCo to amend the authorized/paid capital amount and, to the extent required, the business scope in TaiCo’s articles of incorporation to facilitate the Share Swap. |
9
(c) |
Unless otherwise amended pursuant to this Agreement, details of the share capital the Company on the Share Swap Record Date are as set forth in Exhibit A. Following the incorporation of TaiCo by Buyer, the Parties shall amend Exhibit A to include details of the share capital of TaiCo. |
Section 2.5Directors and Supervisors
. The directors and supervisors of Buyer immediately prior to the Share Swap shall remain unchanged as a result of the Closing. Upon Closing, the directors and supervisors of the Company shall be discharged and replaced by such Persons as Buyer may designate, in its sole discretion.
Article III
CONSIDERATION; PAYMENT
.
Section 3.2Share Swap Entity of Buyer.
(b) |
Upon such designation, all of the rights and obligations of Buyer hereunder shall be automatically assigned and novated to TaiCo; provided, that Buyer shall jointly and severally be liable with TaiCo for the performance by TaiCo of this Agreement. |
(c) |
To the extent required by applicable Law, the Parties shall cooperate with each other to take such appropriate corporate actions to facilitate the designation of TaiCo to be party to the Share Swap as contemplated herein. Other than the designation of TaiCo contemplate herein, the Parties currently do not contemplate other changes to the parties to the Share Swap. |
10
.
(c) |
Any portion of the Payment Fund (and any interest or other income earned thereon) that remains undistributed to the holders of Shares (other than Dissenting Shares) twelve (12) months after the Share Swap Record Date shall be delivered to Buyer upon demand, and any holders of Shares (other than Dissenting Shares) who have not received the Consideration for any Share held by them immediately prior to the Share Swap Record Date shall thereafter look only to Buyer, as general creditor, for payment of the Consideration with respect to such Shares, without interest. In the event that such Payment Fund is insufficient to make the payments contemplated by this Agreement, Buyer shall, and shall cause TaiCo to, promptly deposit additional funds with the Stock Agent in an amount which is equal to the deficiency in the amount required to make such payment. The Payment Fund will not be used for any purpose not expressly provided for in this Agreement. |
. Buyer shall be entitled to deduct and withhold from the consideration otherwise payable to any holder of the Shares pursuant to this Agreement such amounts as may be required to be deducted and withheld pursuant to applicable Law in respect of securities transaction Taxes. To the extent that amounts are so withheld and paid over to the appropriate taxing authority by Buyer (through the Stock Agent), such withheld amounts shall be treated for all purposes of this Agreement as having been paid to the Person in respect of which such deduction and withholding was made. The Stock Agent shall make available, upon request by any seller of Shares, all receipts of payment of the foregoing amounts withheld and treated as having been paid to such seller.
. Since the Consideration to be paid in the Share Swap will be in cash, the Parties agree that this Agreement does not provide the procedure for dealing with fractional shares to be issued to the Company Shareholders.
.
Notwithstanding anything in this Agreement to the contrary, Shares issued and outstanding immediately prior to the Share Swap Record Date that are held by any holder who has exercised such holder’s appraisal rights pursuant to the Taiwan Company Act (the “Company Act”) and the M&A Act (currently, a holder must,
11
either prior to or during the Company Shareholders Meeting, object in writing or object orally (which objection has been recorded by the Company), to the Share Swap and waive such holder’s voting right) and who is entitled to demand and properly demands the Company, by written notice delivered to the Company within twenty (20) days following the Company Shareholders Meeting and stating the proposed price for the sale of such holder’s Shares, to buy back Shares of such holder at the fair market price (the “Appraisal,” and such Shares, “Dissenting Shares,” and each holder of Dissenting Shares, a “Dissenting Shareholder”), shall not have the right to receive any portion of the Consideration. Dissenting Shares shall be treated in accordance with the M&A Act and the Company Act. Following the Company Shareholders Meeting, the Company shall promptly notify Buyer of any demands for Appraisal of any Shares, attempted withdrawals of such notices or demands and any other instruments received by the Company relating to rights to Appraisal, and to the extent permitted by applicable Law, Buyer shall have the right to participate in all negotiations and proceedings with respect to such demands. Prior to the Share Swap Record Date, the Company shall not, without the prior written consent of Buyer, make any payment with respect to, settle or offer to settle, or approve any withdrawal of any such demands; provided, however, that the Company shall have the right to make any payment (i) with respect to, settle or offer to settle, or approve any withdrawal of any such demands, in each case at a per Share price up to but not more than the Consideration, or (ii) at a per Share price determined by a final, non-appealable Order of a court having jurisdiction over the matter in accordance with applicable Law. Notwithstanding anything to the contrary herein, the consummation of the Share Swap shall take place on the Share Swap Record Date irrespective of whether (A) the Company and any Dissenting Shareholder have reached an agreement on the buyback of Dissenting Shares, (B) there is any pending Legal Proceeding between the Company and any Dissenting Shareholder related to buy back of Dissenting Shares and (C) the Company has yet to buy back any and all Dissenting Shares.
Section 3.7Adjustment of Consideration
.
(i)the Company undergoes any stock split, stock and/or cash dividend, reorganization, recapitalization, subdivision, reclassification, combination, exchange of shares or other similar transaction with respect to the outstanding Shares;
(ii)a Change in the Company Group’s financial or business conditions that has a Material Adverse Effect;
(iii)except for any transaction expressly contemplated by this Agreement between the Effective Date and the Share Swap Record Date, any member of the Company Group disposes any of its major assets materially and adversely affecting the Company Group’s financial or business conditions, taken as a whole; or
(iv)a Governmental Entity requires, pursuant to a final, non-appealable Order in accordance with applicable Law, that an adjustment to the Consideration shall be made, or an adjustment to the Consideration is necessary in order to obtain the relevant approvals from such Government Entity.
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Article IV
REPRESENTATIONS AND WARRANTIES OF THE COMPANY
Except as set forth in the disclosure letter dated as of the Effective Date and delivered by the Company to Buyer prior to the execution and delivery of this Agreement (the “Company Disclosure Letter”), which expressly identifies the Section (or, if applicable, subsection) to which such exception relates, the Company represents and warrants to Buyer as follows:
Section 4.1Organization, Standing and Power
.
(b) |
The Company has delivered to Buyer correct and complete copies of the Organizational Documents of the Company, in each case, as amended and in effect on the date hereof, including all amendments thereto. |
.
(a) |
Section 4.2(a) of the Company Disclosure Letter sets forth an ownership structure chart of the Company and its Subsidiaries as of the Effective Date. |
(c) |
Each of the Company’s Subsidiaries (i) is a company duly organized and validly existing under the Laws of the jurisdiction of its incorporation, (ii) has all requisite corporate or similar power and authority to own, lease and operate its properties and assets and to carry on its business as now being conducted and (iii) if such Subsidiary is outside of Taiwan, is duly qualified or licensed to do business in each jurisdiction where the nature of its business or the ownership, leasing or operation of its properties makes such qualification or licensing necessary. All of the outstanding share capital of the Company’s Subsidiaries are validly issued, fully paid and non-assessable and all such shares are owned beneficially and of record by the Company and/or its Subsidiaries free and clear of all Liens. |
(d) |
The Company has delivered to Buyer correct and complete copies of the Organizational Documents of each of the Company’s Subsidiaries, in each case, as |
13
amended and in effect on the date hereof, including all amendments thereto. To the knowledge of the Company, none of the Company’s Subsidiaries is in material default under or in material violation of its Organizational Documents. |
.
(b) |
As of the Effective Date, (i) there are not any outstanding or authorized (A) securities convertible into or exchangeable for shares of capital stock or voting securities of the Company or (B) options, calls, warrants, pre-emptive rights, anti-dilution rights or other rights, rights agreements, shareholder rights plans, agreements, arrangements or commitments of any kind relating to the issued or unissued capital stock, voting securities or securities convertible into or exchangeable for capital stock or voting securities of the Company, (ii) there are no outstanding obligations of the Company to repurchase, redeem or otherwise acquire any capital stock, voting securities or securities convertible into or exchangeable for capital stock or voting securities of the Company, (iii) the Company has not issued, sold or granted phantom stock or other contractual rights the value of which is determined in whole or in part by the value of any capital stock of the Company and there are no outstanding stock appreciation rights issued by the Company with respect to the capital stock of the Company, (iv) there are no voting trusts or other agreements or understandings to which the Company or any of its officers and directors is a party with respect to the voting of capital stock of the Company and (v) there are no outstanding bonds, debentures, notes or other indebtedness of the Company having the right to vote (or convertible into, or exchangeable for, securities having the right to vote) on any matter on which the shareholders or other equity holders of the Company may vote. |
(c) |
There are no outstanding options or warrants to purchase Shares. |
(d) |
The Company holds no treasury shares as of the Effective Date. |
(f) |
Except for this Agreement, there are no outstanding Contracts or other rights of any kind of any Person to purchase or otherwise receive or be issued any equity interest of the Company. |
. The Company has all necessary corporate power and authority to execute and deliver this Agreement, to perform its obligations hereunder and, subject, in the case of the Share Swap, delisting of the Shares and withdrawal of the public reporting status of the Company, to the adoption and approval of this Agreement and the Share Swap by the affirmative vote of the holders representing two-thirds (2/3) of the outstanding Shares entitled to vote on such matter at the Company Shareholders Meeting in accordance with applicable Law (the “Company Shareholder Approval”), to consummate the transactions contemplated hereby. The execution, delivery and performance of this Agreement by the Company and the consummation by the Company of the transactions contemplated hereby have been duly authorized by all necessary corporate action on the part
14
of the Company and no other corporate proceedings on the part of the Company are necessary to approve this Agreement or to consummate the transactions contemplated hereby, subject, in the case of the consummation of the Share Swap, delisting of Shares and withdrawal of the public reporting status of the Company, to obtaining the Company Shareholder Approval. This Agreement has been duly executed and delivered by the Company and, assuming the due authorization, execution and delivery by Buyer, constitutes a legal, valid and binding obligation of the Company, enforceable against the Company in accordance with its terms (except to the extent that enforceability may be limited by applicable bankruptcy, insolvency, moratorium, reorganization or similar Laws affecting the enforcement of creditors’ rights generally or by general principles of equity).
. Except as set forth in Section 4.5 of the Company Disclosure Letter, the execution, delivery and performance of this Agreement by the Company, and the consummation by the Company of the transactions contemplated hereby, do not and will not (i) conflict with or violate the Organizational Documents of the Company, (ii) assuming that all consents, approvals and authorizations contemplated by clauses (i) through (iv) of Section 4.6 have been obtained and all filings described in such clauses have been made, conflict with or violate any Law or any Order of any Governmental Entity, in each case that is applicable to the Company or by which any of its properties are bound, (iii) (A) result in any material breach of or constitute a material default (or an event that with notice or lapse of time or both would become a material default), (B) impair the Company’s rights or alter the rights or obligations of any third party under, (C) give to any third party any rights of termination, amendment, payment, acceleration or cancellation of or (D) result in the creation of a Lien on any of the properties or assets (including intangible assets) of the Company pursuant to, any permit, franchise or Contract to which the Company is a party or by which the Company or any of its properties is bound or affected, (iv) give rise to or result in any Person having, or having the right to exercise, any preemptive rights, rights of first refusal, rights to acquire or similar rights with respect to any capital stock of the Company or any of its Assets or properties, except in the case of the preceding clauses (iii) and (iv) as would not reasonably be expected to have, individually or in the aggregate, a Material Adverse Effect.
. The execution, delivery and performance of this Agreement by the Company, and the consummation by the Company of the transactions contemplated hereby, do not and will not require any consent, approval, Order, license, authorization or permit of, action by, filing, registration or declaration with or notification to, any Governmental Entity, except for (i) the Regulatory Approvals, (ii) such filings as required under applicable securities and corporation Laws, (iii) the filings required under the applicable requirements of antitrust or other competition Laws, investment Laws relating to foreign ownership, and all other Laws that are designed or intended to prohibit, restrict or regulate actions having the purpose or effect of monopolization or restraint of trade or lessening of competition through merger or acquisition (“Antitrust Laws”) and (iv) any other consent, approval, authorization, permit, action, filing or notification the failure of which to make or obtain would not, individually or in the aggregate, reasonably be expected to have a Material Adverse Effect.
Section 4.7Certain Information
.
15
complied in all material respects with the requirements of applicable Law and (ii) did not contain any untrue statement of a material fact or omit to state any material fact required to be stated therein or necessary in order to make the statements therein, in the light of the circumstances under which they are made, not misleading. |
(c) |
The Company Group has appropriate internal controls that are reasonably designed to ensure compliance with applicable Law. |
Section 4.8No Undisclosed Liabilities
. Except as reflected in the Company’s audited consolidated balance sheet as at June 30, 2019 (the “Company Balance Sheet”), the Company Group does not have any material Liabilities other than (i) Liabilities incurred since the date of the Company Balance Sheet in the Ordinary Course of Business and (ii) Liabilities under this Agreement or incurred in connection with the transactions contemplated hereby.
Section 4.9Absence of Certain Changes
. Except as set forth in Section 4.9 of the Company Disclosure Letter, since June 30, 2019 and until the Effective Date, the Company Group has conducted its business and operations in the Ordinary Course of Business and there has not been (i) any Material Adverse Effect or (ii) any action or event that would have required the consent of Buyer pursuant to Section 6.1 had such action or event occurred after the Effective Date.
Section 4.10Compliance with Laws; Permits
.
(a) |
The Company Group is in compliance with, and is not in default under or violation of (and have not received any notice of material non-compliance, default or violation with respect to), any Law applicable to the Company Group or by which any Company Group member’s property is bound including, without limitation, the U.S. Foreign Corrupt Practice Act of 1977, as amended, or other similar applicable anti-corruption or anti-bribery Laws, except for such non-compliance, defaults and violations that would not reasonably be expected to have, individually or in the aggregate, a Material Adverse Effect. |
(b) |
The Company Group is in all material respects in compliance with, and are not in default under or violation of (and have not received any notice of material non-compliance, default or violation with respect to), all export control Laws applicable to the Company Group. The Company Group has not and is not conducting business with Persons in or within Cuba, Iran, North Korea, Sudan or Syria. |
(c) |
The Company Group hold all Permits that are material to the operation of the business of the Company Group as currently conducted, including Environmental |
16
Permits and Building Permits (collectively, the “Company Permits”). No Company Permit shall cease to be effective as a result of the consummation of the transactions contemplated by this Agreement. Except as set forth in Section 4.10(c) of the Company Disclosure Letter, there is no material violation of any material Company Permit that could cause such Company Permit to be revoked or cancelled. |
Section 4.11Legal Proceedings; Orders
. Except as set forth in Section 4.11 of the Company Disclosure Letter, there are no material pending Legal Proceedings (other than Legal Proceedings arising from or relating to the Share Swap or any of the other transactions contemplated by this Agreement), pending, or to the knowledge of the Company, threatened, against any member of the Company Group or any of the Company Group members’ respective properties or assets. None of the Company Group members is subject to any outstanding Order of any Governmental Entity that would prevent or materially delay the consummation of the transactions contemplated by this Agreement. There has not been nor are there currently (nor, to the knowledge of the Company, are there currently contemplated to be) any internal official investigations or inquiries being conducted by the Company, the Company Board (or any committee thereof) or any third party at the request of any of the foregoing concerning any financial, accounting, tax, conflict of interest, self-dealing, fraudulent or deceptive conduct or other misfeasance or malfeasance issues.
Section 4.12Certain Business Practices
. Since the date five (5) years prior to the Effective Date, (i) the Books and Records accurately and fairly reflect, in reasonable detail, all transactions and dispositions of funds or assets and (ii) there have been no false or fictitious entries made in the Books and Records relating to any illegal payment or secret or unrecorded fund.
Section 4.13Restrictions on Business Activities
. Except as set forth in Section 4.13 of the Company Disclosure Letter, none of the Company Group members is a party to, and no asset of the Company Group that is material to the Company Group is bound by, any Contract (excluding, for the avoidance of doubt, any Contracts that have terminated, expired or there are otherwise no ongoing obligations of any party thereunder), Order or decree that: (i) restricts in any material respect or prohibits a Company Group member from (A) competing with any other Person, (B) acquiring any product or other asset or any services from any other Person, (C) developing, selling, supplying, distributing, offering, supporting or servicing any product, technology or other assets to or for any other Person, (D) performing services for any other Person or (E) engaging in a material aspect of the Company Group’s business anywhere in the world, with any Person, or during any period of time; or (ii) grants a right of first refusal, first offer or similar right with respect to a material asset or material aspect of the Company Group’s business.
Section 4.14Contracts and Commitments
.
(i)that (A) is an indenture, credit agreement, loan agreement, collateral agreement to any loan, guarantee, note, mortgage or other agreement providing for indebtedness for borrowed money which exceeds NT$50,000,000 (or the equivalent in
17
another currency) during any 12-month period or (B) creates any obligation under any interest rate, currency or commodity derivatives or hedging transaction;
(ii)that is a Lease Agreement material to the operation of the Company Group;
(iii)relating to a joint venture, joint development, partnership, consortium or similar Contract with any third Person that is material to the business of the Company Group;
(iv)with Significant Customers;
(v)with Significant Suppliers;
(vi)with any related Person not otherwise disclosed in the Company Financial Statements or in the Company Public Reports;
(vii)that is a settlement, conciliation or similar agreement (A) that materially restricts any Company Group member from undertaking its business as currently conducted or (B) that would require a Company Group member to pay consideration of more than NT$30,000,000 after the Effective Date;
(viii)that purports to grant a license to any Intellectual Property Rights held by any upstream Affiliate of the Company Group (including a license that would come into effect as a result of or in connection with the consummation of the Share Swap);
(ix)with (A) any of the five (5) highest paid employees or officers of the Company Group (based on total remuneration for fiscal year 2018); (B) any current employee, officer, director or supervisor of the Company Group who is entitled, in connection with the transactions contemplated by this Agreement (either alone or in connection with additional or subsequent events), to a bonus, retention bonus, severance or termination pay or other benefits in the event of change in control; or (C) any former employee, officer, director or supervisor of the Company Group under which a Company Group member has continuing obligations to such Person equal to or greater than NT$3,000,000;
(x)(A) relating to the acquisition, issuance, voting, registration, sale or transfer of any securities or (B) providing any Person with any preemptive right, right of participation, right of maintenance, right of first refusal or similar right with respect to any securities of the Company, in each case other than Contracts evidencing currently outstanding stock options granted under the Company Equity Plan;
(xi)providing for any guaranty to any Person other than a Subsidiary in an amount in excess of NT$3,000,000;
(xii)that may require a Company Group member to guarantee, reimburse, pledge, defend, hold harmless or indemnify any other Person with respect to Liabilities arising out of Environmental Laws;
(xiii)that constitutes an irrevocable power of attorney or similar Contract; or
18
(xiv)the breach, absence or termination of which would reasonably be expected to have a Material Adverse Effect.
(b) |
Copies of all written Material Contracts have been made available to Buyer prior to the date hereof. |
(c) |
To the knowledge of the Company, (i) each Material Contract currently in effect is valid and enforceable against the applicable Company Group member in accordance with its terms and (ii) no event has occurred, and no circumstance or condition exists, that (with or without notice of lapse of time) will, or would reasonably be expected to, (A) constitute a violation or breach of such Material Contract, (B) give any Person the right to accelerate the maturity or performance of such Material Contract or (C) give any Person the right to cancel, terminate or modify the terms of such Material Contract. |
. Except as set forth in Section 4.15 of the Company Disclosure Letter:
(a) |
Each Company Group member has properly prepared and timely filed (or had properly prepared and timely filed on its behalf) all material Tax Returns required by applicable Law to be filed by or with respect to such Company Group member, and has timely paid in full (or had timely paid in full on its behalf) all material Taxes due and payable (whether or not shown on any Tax Return). All such Tax Returns are true, correct and complete in all material respects. Each Company Group member has timely deducted or withheld and paid over in full to the appropriate Governmental Entity (or had timely deducted or withheld and paid over in full on its behalf) all material Taxes required to be deducted or withheld and paid over (whether or not shown on any Tax Return). None of the Company Group members (i) is a party to or bound by, nor will become bound by, any closing agreement, offer in compromise, gain recognition agreement or any other agreement with any Governmental Entity, or any Tax indemnity, Tax sharing or Tax allocation agreement or arrangement with any Person, or (ii) has actual or, to the knowledge of the Company, contingent liabilities for Taxes, other than (A) Taxes accrued as a liability on the Company Balance Sheet or (B) to the knowledge of the Company, non-delinquent Taxes incurred in the Ordinary Course of Business since December 31, 2018, as adjusted for changes in Tax rates and ordinary course fluctuations in operating results. To the knowledge of the Company, no event or circumstance has occurred that will or could give rise to (1) a Tax Liability of the Company Group in addition to Tax that has already been paid, provided for or disclosed in the Company Financial Statements or (2) a diminution or loss of a Tax Relief contained in the Company Financial Statements or, to the extent that a Tax Relief is not contained in the Company Financial Statements, the diminution or loss of a Tax Relief in respect of or by reference to any moment occurring or period ending on or before the Share Swap Record Date, including in respect of any period commencing before and ending after the Share Swap Record Date the part of such period up to and including the Share Swap Record Date. |
19
Entity of a material Tax deficiency against or with respect to any Company Group member. None of the Company Group members is liable for Taxes of any other Person as a transferee or successor, by Contract, by operation of Law or otherwise. None of the material Tax Returns required by applicable Law is disputed and, to the knowledge of the Company, there is no indication that any such dispute will arise in the future. |
(c) |
None of the Company Group members has engaged in the conduct of a trade or business nor had a permanent establishment or permanent representative (as defined in any tax treaty, if a tax treaty is applicable) or other taxable presence in a jurisdiction with respect to which the required Tax Returns have not been filed. No Governmental Entity has claimed that a Company Group member is subject to Tax in a jurisdiction in which the required Tax Returns have not been filed. Each of the Company Group members has been properly registered for Tax purposes in its country of residence. |
(d) |
There are (and immediately following the Share Swap Record Date there will be) no Liens on the assets of the Company Group relating to or attributable to Taxes other than Liens for Taxes not yet due and payable. |
(e) |
None of the Company Group members will be required to include in any Taxable period (or portion thereof) beginning after the Share Swap Record Date any material amount of Taxable income attributable to income that was economically realized, but not recognized for Tax purposes, prior to the Share Swap Record Date. |
(f) |
The Company has made available to Buyer: (i) accurate and complete copies of all Tax Returns of each of the Company Group members relating to Taxable periods ended on or after December 31, 2017; and (ii) any audit report issued by a Governmental Entity within the past three (3) years relating to any Taxes due from or with respect to any Company Group member. |
Section 4.16Employee Benefit Plans; Employment and Labor Matters
.
(b) |
With respect to the Company Employee Plans: |
(i)each Company Employee Plan has been established and administered in accordance with its terms and in material compliance with applicable Law, and all contributions required to be made under the terms of any Company Employee Plan have been timely made, except for failures to make any contribution that are not material; and
(ii)except as set forth in Section 4.16(b)(ii) of the Company Disclosure Letter, there is no pending Legal Proceeding (including any investigation, audit or other administrative proceeding) by any Governmental Entity or by any plan participant or beneficiary pending, or, to the knowledge of the Company, threatened, relating to the Company Employee Plans.
20
Section 4.17Intellectual Property
.
(a) |
Except as set forth in Section 4.17(a) of the Company Disclosure Letter, all of the Company Registered Intellectual Property are wholly-owned by the Company Group. |
(b) |
The Company Group owns or is licensed or otherwise authorized to use all material Intellectual Property Rights used in the conduct of its business as presently conducted. Immediately following the Closing, the Company Group will have ownership of or licenses to sufficient material Intellectual Property Rights to conduct the business of the Company Group in the manner conducted as of Closing, and the Closing will not result in material payment of any additional economic consideration to any other licensor. |
(e) |
Section 4.17(e) of the Company Disclosure Letter contains a complete and accurate list of all Registered Intellectual Property owned by or filed in the name of any |
21
of the Company Group members (collectively the “Company Registered Intellectual Property”) that remain valid, and has not expired or been cancelled or abandoned. |
(h) |
Whether by operation of law or otherwise, the consummation of the transactions contemplated hereby will not result or cause (i) the breach by any of the Company Group members of any Company IP License, (ii) the termination, impairment or restriction of any right or license granted to a Company Group member under any Company IP License or (iii) a Company Group member to grant, or expand the scope of a prior grant, to a third party of any rights to any of the Company Intellectual Property Rights. |
(i) |
To the knowledge of the Company, there are no issues that may materially and adversely impact the Company Group’s ability to design, manufacture, have made, market, sell or otherwise distribute the Company Products as currently contemplated by the Company Group. |
. To the knowledge of the Company, the IT Systems are adequate and sufficient (including with respect to working condition and capacity) for the operations of the Company Group. The Company Group (i) has taken reasonable measures to preserve and maintain the performance, security and integrity of the IT Systems (and all software, information or data stored on any IT Systems). During the twelve (12) months period prior to the Effective Date, (A) there has been no failure with respect to any IT Systems that has had a material and adverse effect on the operations of the Company Group taken as a whole and (B) there has been no unauthorized access to or use of any IT Systems (or any software, information or data stored on any IT Systems) that has had a material and adverse effect on the operations of the Company Group taken as a whole.
Section 4.19Personal Information
. To the knowledge of the Company, each of the Company Group members has complied in all material respects with all applicable Law, regulatory and self-regulatory guidelines, and published interpretations by Governmental Entities of such Laws and guidelines relating to (i) the privacy of users of any website of the Company Group and (ii) the collection, use, storage, retention, disclosure and disposal of any Personal Information by or on behalf of the Company Group. No Legal Proceedings have been brought or, to the knowledge of the Company, threatened against any of the Company Group members alleging a violation of any Person’s privacy, personal or confidentiality rights.
22
.
(c) |
The use and operation by the Company Group of the Real Property complies in all material respects with all applicable Law. |
(d) |
There are no covenants, rights-of-way, easements or similar restrictions affecting all or any portion of the Real Property that materially impair the ability to use any such Real Property in the operation of the businesses of the Company Group as presently conducted. |
(e) |
None of the Company Group members has received any written notice of the intention of any Governmental Entity or any public or quasi-public body to condemn all or any material part of the Leased Real Property, and there are no pending, or, to the knowledge of the Company, threatened condemnation or eminent domain Legal Proceedings by any public or quasi-public body with respect to the Owned Real Property. |
(f) |
To the knowledge of the Company, no facts exist which would prevent any of the Company Group members from using and operating the Real Property immediately after the Share Swap Record Date in the manner in which the Real Property is currently operated. |
23
Section 4.21Environmental Matters
.
. Section 4.22 of the Company Disclosure Letter sets forth a complete and accurate list of all insurance policies held by or applicable to the Company Group members including, in respect of each such policy, the policy name, policy number and carrier term, type and amount of coverage and annual premium, and the names of the insurers. To the knowledge of the Company, no event has occurred, including the failure by a Company Group member to give any notice or information or a Company Group member giving any inaccurate or erroneous notice or information, which limits or impairs the rights of the Company under any such insurance policies.
Section 4.23Significant Customers
. Section 4.23 of the Company Disclosure Letter sets forth an accurate and complete list of the ten (10) largest customers of the Company Group for the year ended December 31, 2018, based on amounts paid or payable for such period (each, a “Significant Customer”). As of the Effective Date, none of Company Group members has received any written notice from any Significant Customer that such customer intends to terminate or materially modify existing Contracts with such Company Group member.
Section 4.24Significant Suppliers
. Section 4.24 of the Company Disclosure Letter sets forth an accurate and complete list of the ten (10) largest suppliers of goods and/or services to the Company Group for the year ended December 31, 2018, based on amounts paid or payable for such period (each, a “Significant Supplier”). As of the Effective Date, none of the Company Group members has received any written notice from any Significant Supplier that such customer intends to terminate or materially modify existing Contracts with such Company Group member.
. The minute books of each the Company, all of which have been made available to Buyer, contain true, correct and complete records in all material respects of all meetings held by, and corporate action taken by, the shareholders and
24
the Company Board (and its committees). The Company (or its Representatives or agents) have made and kept (and the Company has made available or provided to Buyer to the extent reasonably requested by Buyer in writing) business records, financial books and records, personnel records, ledgers, sales accounting records, tax records and related work papers and other books and records of the Company (the “Books and Records”). The Books and Records have been maintained in accordance with sound business practices in all material respects. The minute books and other Books and Records of the Company are in the possession of the Company.
. No broker, investment banker, financial advisor or other Person is entitled to any broker’s, finder’s, financial advisor’s or other similar fee or commission in connection with the transactions contemplated by this Agreement based upon arrangements made by or on behalf of the Company.
Article V
REPRESENTATIONS AND WARRANTIES OF BUYER
Buyer represents and warrants to the Company as follows:
Section 5.1Organization, Standing and Power
. Buyer (i) is a corporation duly organized, validly existing and, if applicable, in good standing under the Laws of the jurisdiction of its incorporation, (ii) has all requisite corporate power and authority to own, lease and operate its properties and assets and to carry on its business as now being conducted and (iii) as applicable, is duly qualified or licensed to do business and is in good standing in each jurisdiction in which the nature of its business or the ownership, leasing or operation of its properties makes such qualification or licensing necessary, except for any such failures that individually or in the aggregate would not materially prevent Buyer from consummating the transactions contemplated hereby.
. Buyer has all necessary corporate power and authority to execute and deliver this Agreement, to perform its obligations hereunder, and to consummate the transactions contemplated hereby. The execution, delivery and performance of this Agreement by Buyer and the consummation by Buyer of the transactions contemplated hereby have been duly authorized by all necessary corporate action on the part of Buyer and no other corporate proceedings on the part of Buyer are necessary to approve this Agreement or to consummate the transactions contemplated hereby. This Agreement has been duly executed and delivered by Buyer and, assuming the due authorization, execution and delivery by the Company, constitutes a legal, valid and binding obligation of Buyer, enforceable against Buyer in accordance with its terms (except to the extent that enforceability may be limited by applicable bankruptcy, insolvency, moratorium, reorganization or similar Laws affecting the enforcement of creditors’ rights generally or by general principles of equity).
. The execution, delivery and performance of this Agreement by Buyer, and the consummation by Buyer of the transactions contemplated hereby, do not and will not (i) conflict with or violate the Organizational Documents of Buyer, (ii) assuming that all consents, approvals and authorizations contemplated in Section 5.4 have been obtained and all filings described in such clauses have been made, conflict with or violate any Law or any Order of any Governmental Entity, in each case that is applicable to Buyer or by which any of its properties are bound, (iii) (A) result in any material breach of or constitute a material default (or an event that with notice or lapse of time or both would become a material default), (B) impair Buyer’s rights or alter the rights or obligations of any
25
third party under, (C) give to any third party any rights of termination, amendment, payment, acceleration or cancellation of or (D) result in the creation of a Lien on any of the properties or assets (including intangible assets) of Buyer pursuant to, any permit, franchise or Contract to which Buyer is a party or by which Buyer or any of its properties is bound or affected or (iv) give rise to or result in any person having, or having the right to exercise, any preemptive rights, rights of first refusal, rights to acquire or similar rights with respect to any capital stock of Buyer or any of its assets or properties, except in the case of the preceding clauses (iii) and (iv) as would not materially prevent Buyer from consummating the transactions contemplated hereby.
. The execution, delivery and performance of this Agreement by Buyer, and the consummation by Buyer of the transactions contemplated hereby, do not and will not require any consent, approval, Order, license, authorization or permit of, action by, filing, registration or declaration with or notification to, any Governmental Entity, except for (i) the Regulatory Approvals, (ii) such filings as required under applicable securities and corporation Laws, (iii) the filings required under the applicable requirements of Antitrust Laws, (iv) such filings as are necessary to comply with the applicable requirements of the NASDAQ Global Select Market and (v) any such consent, approval, authorization, permit, action, filing or notification the failure of which to make or obtain would not materially prevent Buyer from consummating the transactions contemplated hereby.
Section 5.5Financial Ability of Buyer and TaiCo
. Buyer shall, and shall ensure that TaiCo, have adequate financial ability to fully perform its obligations under this Agreement and to consummate the Share Swap.
. TaiCo will be a wholly-owned Subsidiary of Diodes Incorporated as of the Share Swap Record Date.
. No broker, investment banker, financial advisor or other Person is entitled to any broker’s, finder’s, financial advisor’s or other similar fee or commission in connection with the transactions contemplated by this Agreement based upon arrangements made by or on behalf of Buyer.
Section 6.1Conduct of Business of the Company Pending the Share Swap
.
26
approved by the Company Board prior to the date hereof (together with any other additional capital expenditures approved by the Company Board after the date hereof). |
(b) |
Without limiting the generality of Section 6.1(a), during the Pre-Closing Period, except (A) as specifically permitted elsewhere by this Agreement or (B) if Buyer provides its prior consent in writing, the Company shall not, and shall not permit any of its Subsidiaries to: |
(i)amend the Organizational Documents of any member of the Company Group;
(ii)adopt a plan of complete or partial liquidation, dissolution, merger, consolidation, restructuring, recapitalization or other reorganization, except for the Share Swap contemplated by this Agreement;
(iii)issue, deliver or sell any security of any member of the Company Group or grant any equity-based compensation award, other than the issuance of Shares by the Company to its employees upon the valid exercise of outstanding equity awards;
(iv)except for the dividends and other distributions that have been declared by the any member of the Company Group prior to the Effective Date, declare, set aside or pay any dividend or other distribution, payable in cash, stock, property or any combination thereof, with respect to any of its capital stock (except for any dividend or distribution by a Subsidiary of the Company to the Company or to other Subsidiaries);
(v)split, subdivide or reclassify its capital stock, or enter into any Contract with respect to the voting of any of the Company’s capital stock or other securities or the capital stock or other securities of a Subsidiary of the Company;
(vi)make any capital expenditure, or any commitment with respect thereto, other than in the Ordinary Course of Business;
(vii)(A) acquire (whether by merger, consolidation or acquisition of stock or assets or otherwise) any corporation, partnership or other business organization or division thereof or any material equity interest therein or (B) sell or license any material property or any assets, other than (1) sales or dispositions of inventory and other assets in the Ordinary Course of Business or (2) pursuant to Contracts in effect on the date hereof;
(viii)enter into any material joint venture or partnership;
(ix)(A) make any loans or advances to any other Person (other than to a Subsidiary of the Company or to employees of any Company Group member in the Ordinary Course of Business), (B) incur any indebtedness for borrowed money other than in the Ordinary Course of Business or issue any debt securities or (C) assume, guarantee, endorse or otherwise become liable or responsible for the obligations of another Person (other than the Company or any of its Subsidiaries);
(x)except to the extent required by applicable Law or otherwise specifically required by this Agreement, (A) increase the compensation or benefits of any current or former director, supervisor, officer or consultant of any member of the Company Group, (B) other than in the Ordinary Course of Business, increase the compensation or benefits of any current or former employee (other than an officer) of any member of the
27
Company Group, (C) amend, terminate or adopt any Company Employee Plan, (D) accelerate the vesting of, or the lapsing of restrictions with respect to, any stock options or other stock-based compensation, (E) fail to make any required contributions under any Company Employee Plan, (F) hire or terminate the employment of any C-level executive of any member of the Company Group or (G) pay any compensation or remuneration to any Person for his or her service as a director or supervisor of any member of the Company Group for any period commencing on or after January 1, 2019, other than in the Ordinary Course of Business and in such amounts substantially consistent with past levels of payment;
(xi)other than in the Ordinary Course of Business, enter into, amend in any material respect or terminate (other than a termination in accordance with its terms) any Material Contract;
(xii)effectuate a layoff as defined in the Taiwan Act for Worker Protection of Mass Redundancy;
(xiii)create any Subsidiary other than WBG PowerSystems (Cayman) Co., Ltd. and Lyra Semiconductor Incorporated (芯籟半導體股份有限公司); or
(xiv)enter into any Contract obligating it to take any of the actions described in Section 6.1(b)(i) through Section 6.1(b)(xiii).
Section 6.2Acquisition Proposals
(a) |
Upon the Effective Date, the Company shall, and shall cause its Representatives (as defined below) to immediately cease and cause to be terminated any and all existing discussions or negotiations with any Person (other than Buyer) conducted heretofore with respect to any Acquisition Proposal or any proposal, inquiry or offer that would reasonably be expected to lead to an Acquisition Proposal. |
28
or inquiry, proposal or offer, and the material terms and conditions thereof) that is made or submitted by any Person during the Pre-Closing Period, and (ii) keep Buyer informed, on a reasonably current basis, of the status of, and any financial or other changes in, any such Acquisition Proposal, inquiry, proposal or offer. |
Section 6.3Access to Information
. At all times during the Pre-Closing Period, upon reasonable prior notice, the Company shall (and shall use reasonable best efforts to cause its Representatives to), to the extent permitted by applicable Law, afford to Buyer and its respective Representatives reasonable access without undue interruption during normal business hours, consistent with applicable Law, to the Company’s officers, employees, properties, offices, other facilities and Books and Records, and shall furnish Buyer and its Representatives with such financial, operating and other data and information as such Persons shall reasonably request in connection with the Share Swap.
. The Confidentiality Agreement is incorporated herein by reference. The Confidentiality Agreement shall govern the confidentiality and non-disclosure obligations of the Parties with respect to Proprietary Information (as defined in the Confidentiality Agreement) exchanged in connection with the negotiation, preparation or execution of this Agreement or the negotiation and consummation of the transactions contemplated hereby.
Section 6.5Company Shareholders Meeting; Governance Matters
.
(b) |
The Company shall use commercially reasonable efforts to procure that the number of Shares represented by shareholders present at the Company Shareholders Meeting in person or by proxies (including by electronic voting) will meet the applicable quorum requirements for resolution on the approval for the Share Swap. |
.
29
Law to cause the conditions set forth in Article VII to be satisfied as soon as reasonably possible. Each Party shall refrain from carrying out any action or omitting anything that could, directly or indirectly, cause delay, hinder, impede or prejudice satisfaction of the conditions set forth in Article VII. |
(b) |
In the event that any administrative or judicial action or proceeding is instituted (or threatened to be instituted) by a Governmental Entity or any other Person challenging (any part of) the Share Swap prior to Closing, each Party shall cooperate in all respects with the other Party and use its commercially reasonable efforts to defend, contest and resist any such action or proceeding and to have vacated, lifted, reversed or overturned any Order, whether temporary, preliminary or permanent, that is in effect and that reasonably prohibits, prevents or restricts the consummation of the Share Swap. |
(c) |
No Party shall fail to take or cause to be taken any action that would reasonably be expected to prevent, impede or materially delay the consummation of the transactions contemplated hereby. |
Section 6.7Regulatory Approval and Antitrust Law Filings
.
(b) |
To the extent permitted by applicable Law, each of Buyer and the Company shall (i) provide the other Party and/or its legal counsel with drafts of all written filings and other communications intended to be submitted to any Governmental Entity in respect of any filings required under applicable Antitrust Laws or to obtain the Regulatory Approvals, (ii) give the other Party and/or its legal counsel a reasonable opportunity to comment on such filings and communications, (iii) not submit such filings or communications without the prior written consent of the other Party, such consent not to be unreasonably withheld or delayed, and (iv) upon request by the other Party, provide the other Party and/or its legal counsel with final copies of all such filings and material written communications. |
30
one another, and consider in good faith the views of one another, in connection with any analyses, appearances, presentations, memoranda, briefs, arguments, opinions and proposals made or submitted by or on behalf of either Party hereto in connection with proceedings under or relating to applicable Antitrust Laws and (ii) provide advance notice of and permit authorized representatives of the other party to be present at each meeting or conference with any Governmental Entity (to the extent permitted by applicable Law and such Governmental Entity). |
(d) |
Notwithstanding anything to the contrary in this Section 6.7, materials provided to the other Party or its counsel may be redacted to remove references concerning privileged communications and competitively sensitive information. Notwithstanding anything to the contrary herein, the Parties understand and agree that reasonable best efforts of any Party shall not be deemed to include (i) entering into any settlement, undertaking, consent decree, stipulation or agreement with any Governmental Entity in connection with the transactions contemplated hereby or (ii) diverting or otherwise holding separate (including by establishing a trust of otherwise), or taking any other action (or otherwise agreeing to do any of the foregoing) with respect to any of its or any of its respective Affiliates’ businesses, assets or properties. |
(e) |
The Party required by Law to file in connection with applicable Antitrust Laws and the Regulatory Approvals (the “Filing Party”) shall bear all filing fees in relation to such filings (except that all filing fees in relation to the delisting and cancellation of the Company’s status as a public company shall be borne by the Company). All costs, penalties and fines resulting from not (timely or correctly) filing, shall be borne by the Filing Party. |
Section 6.8Public Announcements
. Prior to the Company making any press release or public announcement in respect of this Agreement or the transactions contemplated by this Agreement or otherwise communicate with any news media, the Company shall provide to Buyer the draft of such press release or public announcement and allow Buyer reasonable opportunity and time to comment on such draft, and shall give due consideration to reasonable additions, deletions or changes suggested thereto by Buyer. Prior to Buyer making any press release or public announcement in respect of this Agreement or the transactions contemplated by this Agreement or otherwise communicate with any news media, Buyer shall provide to the Company the draft of such press release or public announcement in advance. The Parties shall cooperate as to the timing and contents of any press release, public announcement or communication.
Section 6.9Notification of Certain Matters
.
(a) |
During the Pre-Closing Period, each Party shall promptly notify the other Party in writing upon becoming aware that any representation or warranty made by it in this Agreement has become untrue or inaccurate in any material respect, or of any failure by it to comply with or satisfy any covenant, condition or agreement to be complied with or satisfied by it pursuant to this Agreement. No notification given to the other Party pursuant to this Section 6.9 shall limit or otherwise affect any of the representations, warranties or covenants of such Party contained in this Agreement or any of the remedies available to the other Party hereunder. |
(b) |
During the Pre-Closing Period, each Party shall promptly notify the other Party of any Legal Proceeding that shall be instituted or threatened against such Party to |
31
restrain, prohibit or otherwise challenge the legality of, or seek damages in connection with, this Agreement or the Share Swap. The Company shall give Buyer the opportunity to participate, at Buyer’s expense, in the defense or settlement of any shareholder litigation against the Company and/or its officers or directors relating to the Share Swap, and no such settlement shall be agreed with Buyer’s prior written consent (which consent shall not be unreasonably withheld or delayed). |
. At the Closing on the Share Swap Record Date, the Company shall cause to be delivered to one or more authorized Representative(s) of Buyer all chops associated with all bank accounts of the Company Group members.
Article VII
CONDITIONS TO CLOSING
Section 7.1Conditions to Each Party’s Obligations to Effect the Share Swap
. The respective obligations of each Party to effect the Share Swap are subject to the satisfaction at or prior to the Share Swap Record Date of each of the following conditions, any and all of which may be waived, in whole or in part, by Buyer and the Company, to the extent permitted by applicable Law:
(c) |
Regulatory Approvals. The Regulatory Approvals, for the consummation of the Share Swap and the transactions contemplated hereby, shall have been obtained. |
(d) |
No Injunctions. No restraining order, preliminary or permanent injunction or other Order issued by a Governmental Entity or other legal constraint or prohibition preventing the consummation of the transactions contemplated hereby will have taken effect after the Effective Date and still be in effect. |
(e) |
No Illegality. No applicable Law shall have been enacted, entered, enforced, issued or put in effect that prohibits or makes illegal the consummation of the Share Swap. |
(f) |
Termination. This Agreement shall not have been terminated in accordance with its terms. |
Section 7.2Conditions to Buyer’s Obligations to Effect the Share Swap
. The obligations of Buyer to effect the Share Swap are subject to the satisfaction at or prior to the Share Swap Record Date of each of the following conditions, any and all of which may be waived, in whole or in part, by Buyer in its sole discretion, to the extent permitted by applicable Law:
(a) |
Representations and Warranties True. The representations and warranties of the Company set forth in Article IV shall be true and correct in all material |
32
respects (except for each such representations and warranties that contains an express materiality qualification, which shall be true and correct in all respects) as of the Effective Date and as of the Share Swap Record Date, or in the case of representations and warranties that are made as of a specified date, such representations and warranties shall be true and correct in all material respects (except for each such representations and warranties that contains an express materiality qualification, which shall be true and correct in all respects) as of such specified date. |
(b)Performance of Covenants. The Company shall have performed or complied in all material respects all the covenants and agreements that are required to be performed by the Company under this Agreement at or prior to the Share Swap Record Date.
(e) |
Certificate. The Company shall have delivered to Buyer a certificate signed by an authorized officer of the Company, dated as of the Share Swap Record Date, stating that the conditions specified in Section 7.2(a), Section 7.2(b), Section 7.2(c) and Section 7.2(d) have been satisfied. |
(f) |
Third Party Consents. All third party consents listed in Exhibit B for the consummation of the Share Swap and the transactions contemplated hereby by the Company shall have been obtained by the Company. |
Section 7.3Conditions to the Company’s Obligations to Effect the Share Swap
. The obligations of the Company to effect the Share Swap are also subject to the satisfaction at or prior to the Share Swap Record Date of the following conditions, any and all of which may be waived, in whole or in part, by the Company in its sole discretion, to the extent permitted by applicable Law:
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(c) |
Certificate. Buyer shall have delivered to the Company a certificate signed by an authorized officer of Buyer, dated as of the Share Swap Record Date, stating that the conditions specified in Section 7.3(a) and Section 7.3(b) have been satisfied. |
Section 7.4Satisfaction and Waiver of Conditions to Closing
. Each of the Company and Buyer, as the case may be, shall inform the other Party in writing within three (3) Business Days of becoming aware of (i) the satisfaction of any applicable condition to closing in this Article VII (each, a “Condition to Closing”) or (ii) any circumstance that has resulted, or will result, in a failure to satisfy any Condition to Closing, and shall provide due evidence of such satisfaction or failure to satisfy.
Article VIII
TERMINATION, AMENDMENT AND WAIVER
. This Agreement may be terminated and the Share Swap may be abandoned at any time prior to the Share Swap Record Date, notwithstanding approval thereof by the shareholders of the Company, only as follows:
34
The Party desiring to terminate this Agreement pursuant to this Section 8.1 shall give notice of such termination and the provisions of this Section 8.1 being relied on to terminate this Agreement to the other Parties.
Section 8.2Effect of Termination
. In the event of termination of this Agreement pursuant to Section 8.1, this Agreement shall forthwith become void and have no effect, without any liability or obligation on the part of Buyer, the Company or their respective directors, officers, Affiliates or shareholders, except that the provisions of Section 6.4 (Confidentiality), Section 6.8 (Publicity), this Section 8.2 (Effect of Termination), and Article IX (General Provisions), of this Agreement shall survive the termination hereof. Notwithstanding the foregoing, nothing contained herein shall relieve any Party of liability for an intentional breach of its covenants or agreements set forth in this Agreement prior to such termination or for fraud.
. This Agreement, the Exhibits and other documents referred to herein contain the complete agreement between the Parties and supersede any prior understandings, agreements or representations by or between the Parties, written or oral, which may have related to the subject matter hereof in any way.
. Whenever possible, each provision of this Agreement shall be interpreted in such manner as to be effective and valid under applicable Law, but if any provision of this Agreement is held to be prohibited by or invalid under applicable Law, such provision shall be ineffective only to the extent of such prohibition or invalidity, without invalidating the remainder of such provision or the remaining provisions of this Agreement.
. All notices or other communications required or permitted hereunder shall reference this Agreement, shall be in writing in the English language, shall be delivered personally, by overnight courier, by electronic mail or by certified, registered or express air mail, postage prepaid, and shall be deemed given (i) when so delivered personally, (ii) when so received by courier, (iii) if given by electronic mail, when receipt of the message is confirmed to the sender by the systems of the Party to which notice is intended to be given, or (iv) if mailed, five (5) Business Days after the date of mailing, as follows:
(a) |
if to Buyer, to: |
Diodes Incorporated
4949 Hedgcoxe Rd. Suite 200
Plano, Texas 95024
USA
Attn: K.S. Lu
Email: ks_lu@diodes.com
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Lite-On Semiconductor Corp.
4F, 392 Ruiguang Rd.
Neihu Dist.
Taipei 11492, Taiwan
Attn: David Lee
Email: david.lee@liteonsemi.com
Section 9.4Amendment or Supplement
. This Agreement may be amended, modified or supplemented by the Parties by action taken or authorized by written agreement of the Parties (by action taken by their respective boards of directors, if required) at any time prior to the Share Swap Record Date, whether before or after the Company Shareholder Approval has been obtained; provided, however, that after the Company Shareholder Approval has been obtained, no amendment shall become effective that pursuant to applicable Law requires further approval or adoption by the Company Shareholders without such further approval or adoption. This Agreement may not be amended, modified or supplemented in any manner, whether by course of conduct or otherwise, except by an instrument in writing specifically designated as an amendment hereto, signed on behalf of each of the Parties in interest at the time of the amendment.
Section 9.5Extension of Time; Waiver
. At any time prior to the Share Swap Record Date, the Parties may (by action taken or authorized by their respective boards of directors, if required), to the extent permitted by applicable Law, (i) extend the time for the performance of any of the obligations or acts of the Company (in the case of an extension by Buyer) or Buyer (in the case of an extension by the Company), as applicable, (ii) waive any inaccuracies in the representations and warranties of the Company (in the case of a waiver by Buyer) or Buyer (in the case of a waiver by the Company), set forth in this Agreement or any document delivered pursuant hereto or (iii) subject to applicable Law, waive compliance with any of the agreements or conditions of the Company (in the case of a waiver by Buyer) or Buyer (in the case of a waiver by the Company) contained herein; provided, however, that after the Company Shareholder Approval has been obtained, no waiver may become effective that pursuant to applicable Law requires further approval or adoption by the Company Shareholders without such further approval or adoption. Any agreement on the part of a Party to any such waiver shall be valid only if set forth in a written instrument executed and delivered by a duly authorized officer on behalf of such Party, as applicable. No failure or delay of any Party in exercising any right or remedy hereunder shall operate as a waiver thereof, nor shall any single or partial exercise of any such right or power, or any abandonment or discontinuance of steps to enforce such right or power, or any course of conduct, preclude any other or further exercise thereof or the exercise of any other right or power.
. None of Diodes Incorporated or any of its Subsidiaries has entered or will enter into any agreement with any director or major shareholder (as defined in the Taiwan Securities and Exchange Act) of the Company that provides for a shareholder rollover or similar arrangement in connection with the Share Swap.
Section 9.7Successors and Assigns
. This Agreement and all of the provisions hereof shall be binding upon and inure to the benefit of the Parties and their respective successors and permitted assigns. This Agreement, and all of Buyer’s rights, interests and obligations hereunder may be assigned or delegated by Buyer to TaiCo in accordance with
36
Section 3.2; provided, that no such assignment or delegation shall relieve Buyer of its obligations hereunder. Except as set forth in the immediately preceding sentence, this Agreement may not be assigned, nor the rights or obligations of any Party transferred or delegated to any other Person without the prior written consent of the other Party.
. Each and all of the various rights, powers and remedies of a Party will be considered to be cumulative with and in addition to any other rights, powers and remedies which such Party may have at law or in equity in the event of the breach of any of the terms of this Agreement. The exercise or partial exercise of any right, power or remedy will neither constitute the exclusive election thereof nor the waiver of any other right, power or remedy available to such Party.
. All issues and questions concerning the construction, validity, interpretation and enforceability of this Agreement and the Exhibits hereto shall be governed by, and construed in accordance with, the laws of Taiwan, without giving effect to any choice of law or conflict of law rules or provisions that would cause the application of the laws of any jurisdiction other than the Taiwan.
Section 9.10Dispute Resolution
.
(c) |
Any such arbitration will be conducted before a panel of three (3) arbitrators, each of whom will be compensated for his or her services at a rate to be determined by the CAA. Each of the claimant and the respondent shall appoint one (1) arbitrator, and the claimant and the respondent shall jointly appoint the third arbitrator as the chief arbitrator. If the Parties are unable to agree on the arbitrators within thirty (30) days following submission of the dispute to CAA by one of the Parties, CAA will have the authority to select the arbitrators from a list of arbitrators who satisfy the criteria set forth in Section 9.10(d). |
37
writing to waive such requirement with respect to an individual in connection with any Arbitrable Dispute. |
(e) |
The claimant shall advance the arbitration fees required by the CAA upon demanding for arbitration; provided, however, that: (i) the prevailing Party in any arbitration will be entitled to an award of attorneys’ fees and costs; and (ii) all fees and costs of arbitration will be paid by the losing Party, unless other provided in the arbitral award. The arbitrator will be authorized to determine the identity of the prevailing Party and the losing Party. |
(f) |
Except as specifically otherwise provided herein, arbitration will be the sole and exclusive remedy of the Parties for any Arbitrable Dispute. |
. Except as may otherwise be agreed to hereunder or in other writing by the Parties, all fees and expenses incurred in connection with this Agreement, the Share Swap and the other transactions contemplated hereby shall be borne and timely paid by the Party incurring such fees or expenses, whether or not the Share Swap is consummated.
. All references to “NT$” in this Agreement refer to New Taiwan Dollars.
. This Agreement may be executed in multiple counterparts, any one of which need not contain the signature of more than one Party, but all such counterparts taken together shall constitute one and the same instrument.
Section 9.14Delivery by Electronic Transmission
. This Agreement and any signed agreement entered into in connection herewith or contemplated hereby, and any amendments hereto or thereto, to the extent signed and delivered by means of a facsimile machine or by .pdf, .tif, .gif, .jpeg or similar attachment to electronic mail, shall be treated in all manner and respects as an original contract and shall be considered to have the same binding legal effects as if it were the original signed version thereof delivered in person. At the request of a Party to any such contract, the other Party shall re-execute original forms thereof and deliver them to the requesting Party. No Party to any such contract shall raise the use of a facsimile machine or by .pdf, .tif, .gif, .jpeg or similar attachment to electronic mail to deliver a signature or the fact that any signature or contract was transmitted or communicated through the use of facsimile machine or by .pdf, .tif, .gif, .jpeg or similar attachment to electronic mail as a defense to the formation of a contract and such Party forever waives any such defense.
[Signature page follows]
38
IN WITNESS WHEREOF, the Parties have executed this Agreement on the date first written above by.
DIODES INCORPORATED
By: |
/s/ K.S. Lu |
Name: |
K.S. Lu |
Title: |
President and Chief Executive Officer |
LITE-ON SEMICONDUCTOR CORP.
By: |
/s/ Paul Lo |
Name: |
Paul Lo |
Title: |
Independent Director and Authorized Representative |
[Signature Page to Share Swap Agreement]
Share Capital on Share Swap Record Date
Party |
Authorized Capital |
Paid-In Capital |
Company |
NT$5,000,000,000 |
NT$3,124,566,880 |
TaiCo |
NT$[●] |
NT$[●] |
Third Party Consents of the Company
簽約日期 |
公司名稱 |
相對人 |
合約名稱 |
民國105年6月22日 |
敦南科技 |
統籌主辦銀行: 台北富邦商業銀行股份有限公司 中國信託商業銀行股份有限公司
管理銀行: 台北富邦商業銀行股份有限公司 |
聯合授信合約書 |
Company Disclosure Letter to the Share Swap Agreement
Reference is made to the Share Swap Agreement (the “Agreement”) dated as of August 8, 2019 by and between Diodes Incorporated, a company incorporated and in existence under the laws of the State of Delaware, USA and having its principal place of business at 4949 Hedgcoxe Rd., Suite 200, Plano, Texas, USA (“Buyer”) and Lite-On Semiconductor Corp., a company incorporated and in existence under the laws of Taiwan with uniform commercial number of 23528103 and having its registered address at 4F. No. 392, Ruiguang Rd., Neihu Dist., Taipei, Taiwan (the “Company”).Capitalized terms used herein but not otherwise defined shall have the respective meanings assigned to such terms in the Agreement.
The Company Disclosure Letter is being delivered by the Company pursuant to the Agreement and qualifies the representations and warranties of the Company by reference to specific provisions in Article IV of the Agreement. Each exception set forth in the Company Disclosure Letter is identified by reference to, or has been grouped under a heading referring to, a specific individual section or subsection of the Agreement; provided, however, that the inclusion of any item referenced in one section or subsection of the Company Disclosure Letter shall be deemed to refer to any other section or subsection of the Company Disclosure Letter, whether or not an explicit cross-reference appears, if the applicability of such item to the other section or subsection is reasonably apparent on its face without reference to underlying documents therein. The inclusion of any information in the Company Disclosure Letter shall not be deemed to be an admission or evidence of the materiality of such item, nor shall it establish a standard of materiality for any purpose whatsoever. Matters reflected in the Company Disclosure Letter are not necessarily limited to matters required by the Agreement to be disclosed in the Company Disclosure Letter. Neither the specification of any dollar amount in the representations and warranties contained in the Agreement nor the inclusion of any specific item in the Company Disclosure Letter is intended to imply that such amounts, higher or lower amounts, the items so included, or other items, are or are not material, and no Party shall use the fact of the setting of such amounts or the fact of the inclusion of any such item in the Company Disclosure Letter in any dispute or controversy between the Parties as to whether any obligation, item or matter is or is not material, or may constitute an event or condition which could be considered to have a Material Adverse Effect.
Company Disclosure Letter Sections
Section 4.2(a) – Company Group Chart Section 4.2(b) – Subsidiaries
Section 4.3(e) – Future Investments
Section 4.5 – No Conflict
Section 4.9 – Absence of Certain Changes
Section 4.10(c) – Material Violation of Permits Section 4.11 – Legal Proceedings
Section 4.13 – Restriction on Business Activities Section 4.14(a) – Material Contracts
Section 4.15 – Tax Matters
Section 4.16(a) – Company Employee Plans
Section 4.16(b)(ii) – Legal Proceedings Relating to Company Employee Plans Section 4.16(d) – Compliance with Labor Laws
Section 4.17(a) – Intellectual Property Not Wholly-Owned by the Company Group Section 4.17(c) – Legal Proceedings Relating to Intellectual Property
Section 4.17(d) – Violations of Employee Confidentiality Obligations Section 4.17(e) – Company Registered Intellectual Property
Section 4.17(f) – Orders Relating to Company Intellectual Property Rights Section 4.17(g) – Material Violations of Company IP Licenses
Section 4.20(a) – Owned Real Property
Section 4.20(a)(A) – Marketable Title to Owned Real Property
Section 4.20(b) – Leased Real Property
Section 4.21(a) – Environmental Law Compliance
Section 4.21(b) – Environmental Permits
Section 4.21(c) – Legal Proceedings Relating to Environmental Law
Section 4.22 – Insurance
Section 4.23 – Significant Customers
Section 4.24 – Significant Suppliers
i
Section 4.2(a) – Company Group Chart
敦南科技股份有限公司
Lite-On Semiconductor Corp. (TWN)
(簡稱: LSC)
100%
Smart Power Holdings Group Co., Ltd. (BVI)
Dyna International Holding Co., Ltd.
(BVI)
On-Brilliant Electronics (HK) Co., Limited
100%
台灣昂寶電子股份有限 公司 (TW)
99.67%
新茂國際科技股份有限 公司 (TW)
SyncMOS Technologies Int’l Inc.
漣花智硯(廣州)有限 公司
LY Intelligent (Guangzhou) Co., Ltd.
備註:有新設兩子公司(如下),目前尚未注資。
1. Lite-On Semiconductor America Inc.(2017.09設立;預計資本額20萬美金;LSC100%
持有)
1
2. WBG PowerSystem (Cayman) Co., Ltd.(寬頻芯科技(開曼)有限公司) (預計資本額300萬
2
美金;LSC持有65%)
3. 上述紅框內為昂寶暨其所屬下轄公司,不屬於本交易所定義之子公司。
3
Section 4.2(b) – Subsidiaries
MARKETABLE SECURITIES HELD:
Held Company |
Marketable Securities Type and Name |
Shares |
Percentage of Ownership (%) |
Carrying Value As of 2019/6/30 |
Lite-ON Semiconductor Corp. |
Ordinary Shares
朋程科技股份有限公 司 (Taiwan R.O.C.) |
2,994,785 |
4% |
NTD293,788,409 |
Lite-ON Semiconductor Corp. |
Ordinary Shares
廣閎科技股份有限公 司 (Taiwan R.O.C.) |
3,380,000 |
8.32% |
45,160,400 |
Lite-ON Semiconductor Corp. |
Ordinary Shares
路竹開發股份有限公 司 (Taiwan R.O.C.) |
7,969,500 |
4.05% |
74,609,018 |
Lite-ON Semiconductor Corp. |
Ordinary Shares Global Strategic investment Inc (Samoa) (Samoa) |
260,967 |
0.74% |
2,381,702 |
Lite-ON Semiconductor Corp. |
Ordinary Shares
普實創業投資股份有 限公司 (Taiwan R.O.C.) |
161,280 |
0.38% |
842,788 |
Lite-ON Semiconductor Corp. |
Ordinary Shares GLOBAL STRATEGIC |
147,000 |
0.75% |
- |
4
|
INVESTMENT INC. (Cayman) |
|
|
|
Lite-ON Semiconductor Corp. |
Preferred Stock SINGLE CHIP SYSTEMS CORP. (U.S.A) |
341,635 |
1.26% |
- |
Lite-ON Semiconductor Corp. |
Ordinary Shares
光碁科技股份有限公 司 (Taiwan R.O.C.) |
811,920 |
2.71% |
- |
Lite-ON Semiconductor Corp. |
Preferred Stock Newport Imagine Corporation (U.S.A) |
211,864 |
1.46% |
- |
NAME OF INVESTEES OVER WHICH THE PARENT COMPANY EXERCISES SIGNIFICANT INFLUENCE:
(Amounts in Thousands of New Taiwan Dollars or Thousands of Foreign Currencies)
Investor Company |
Investee Company |
Original Investment Amount |
Shares (In Thousands) |
Percentage of Ownership (%) |
Carrying Amount As of 2019/6/30 |
Lite-ON Semiconductor Corp. |
On-Bright Electronics Incorporated (Cayman) |
286,160 |
17,464 |
31.19% |
1,193,605 |
Lite-ON Semiconductor Corp. |
Dyna International Holding Co. Ltd (B.V.I) |
3,413,337 |
107,698 |
100% |
5,838,704 |
Lite-ON Semiconductor Corp. |
DIODES INC. (U.S.A) |
77,237 |
7,766 |
15.3% |
4,642,290 |
Lite-ON |
Smart Power |
78,366 |
50 |
100% |
- |
5
Semiconductor Corp. |
Holding Group Co. Ltd. (B.V.I) |
|
|
|
|
Lite-ON Semiconductor Corp. |
菲律賓敦南科 技股份有限公 司 (Philippines) |
519,527 |
79,595 |
100% |
- |
Lite-ON Semiconductor Corp. |
新東亞微電子 股份有限公司 (Taiwan R.O.C) |
41,298 |
5,015 |
12.23% |
- |
Lite-ON Semiconductor Corp. |
敦宏科技股份 有限公司 (Taiwan R.O.C) |
102,049 |
8,497 |
27,43% |
- |
Dyna International Holding Co. Ltd |
Dyna International Co. Ltd (B.V.I) |
USD111,363 |
111,363 |
100% |
USD189,137 |
Dyna International Co. Ltd |
Lite-On Semiconductor (HK) Limited (Hong Kong) |
USD113,448 |
110,000 |
100% |
USD188,784 |
INFORMATION ON INVESTMENT IN MAINLAND CHINA:
(Amounts in Thousands of New Taiwan Dollars or Thousands of Foreign Currencies)
Investor Company |
Investee Company |
Total Amount of Paid-in Capital |
Percentage of Ownership (%) |
Lite-On Semiconductor (HK) |
上海旭福電子有限公司 |
USD26,000 |
100% |
6
Limited |
(China) |
|
|
Lite-On Semiconductor (HK) Limited |
敦南科技(無錫)有限公 司 (China) |
UDS43,000 |
100% |
Lite-On Semiconductor (HK) Limited |
敦南微電子(無錫)有限 公司 (China) |
USD40,000 |
100% |
Note : 依據敦南科技公告財務報告之附表分類表達
Note : The investment information list was followed the classification of financial report.
7
Section 4.3(e) – Future Investments
投資標的 |
投資型式 |
投資幣別 |
投資原幣金額 |
目前狀態 |
WBG PowerSystems |
Joint venture |
USD |
1,950,000 |
Cayman公司已設立,近 |
(Cayman) Co., Ltd. |
期將注資, |
|||
(中文名稱:寬頻芯 |
|
|||
|
總投資金額USD |
|||
科技(開曼)有限公 |
|
|||
|
3,000,000,本公司佔 |
|||
司) |
|
|||
65%。 |
||||
芯籟半導體(股)公 |
現金增資 |
NTD |
204,000,000 |
目前發出LOI,本公司預 |
司 |
計參與現金增資後,持 |
|||
|
|
|||
(英文名稱:Lyra |
有該公司50%股權(目前 |
|||
Semiconductor Incorporated) |
未有持股) |
8
Section 4.5 – No Conflict
Nil
9
Section 4.9 – Absence of Certain Changes
公司於2019年07月底向芯籟半導體(股)公司發出投資意向書,擬藉由參予該公司現金增 資方式,取得50%股權,股數約20,400,000股,每股金額10元。
10
Section 4.10(c) – Material Violation of Permits
敦南科技(股)公司
項目 |
說明 |
nil |
敦南微電子(無錫)有限公司
|
政府主管部門 |
要求整改項目 |
1 |
新吴区排水管理处 |
雨水、污水管网整改 |
2 |
新吴区应急管理局 |
特气房安全改造 |
上海旭福電子有線公司
|
政府主管部門 |
要求整改項目 |
1 |
松江区生态环保局 |
SMD扩充环评 |
2 |
松江区生态环保局 |
废气排放整改 |
3 |
松江区应急管理局 |
化学品仓库整改 |
敦南科技(無錫)有限公司
項目 |
說明 |
被政府裁罰項目 |
敦南科技(無錫)有限公司"12.8"壓力容器一般事故 |
被政府要求改善 |
1. 特氣室重新進行隱患排查並及時整改 |
項目 |
|
2. 制定特種設備操作規範 |
|
3. 配備符合生產需要的持證特種設備作業人員 |
|
政府機關名稱; |
1. 無錫市市場監督管理局;2019/3/21;無錫市市場監督管理局關於 |
公文日期;公文 |
|
標題 |
敦南科技(無錫)有限公司"12.8"壓力容器一般事故結案的請示 |
2. 無錫市人民政府;2019/4/5;市政府關於敦南科技(無錫)有限公 |
|
司"12.8"壓力容器一般事故結案的批覆 |
10
Section 4.11 – Legal Proceedings
(1)Any memoranda of counsel with respect to pending or threatened litigation during last 3 years.
ITEM |
訴訟原由 |
目前狀況 |
#1 |
l事故: 2018.10.16 Dr. Johannes Heidenhain GmbH (以下簡稱 H 公司)將 Diodes 元件焊上電路板後 發現 Defect,導致 19,359 片電路板報廢無法使 用。 l案由:德國訴訟請求損害賠償 EUR 769,781 元 l原告: Allianz Global Corporate & Specialty SE 保 險公司(代位求償-被保人 EBV Elektronik GmbH & Co. KG 公司) l被告:STMicro electronics Pte Ltd.(以下簡稱 ST) l2018.10.3 ST 發函要求敦南承擔訴訟賠償請求的 金額 l歷史事件:2015.8.3 敦南出具 8D report 給 ST,表明 有 die crack; root cause: the pin mark in the middle of the die。但 2015.11.6ST 出具 8D report 給 H 公司為 confirmed: die was broken, root cause: a particle at wafer mounting between the blue tape and the wafer。 |
未知 |
#2 |
l 事故:2014.10.7 原告公司機房中聯想電腦主機失 |
2018.5.3敦南通知我 |
火,起火點初判為電源供應器引起。 |
方AON保險公司委由 |
|
l 案由:法國訴訟請求損害賠償 EURO1,442,000 |
其在法國的分支據點 |
|
l 原告:法國 LE GARUN-LA PAYSANNE 農業合作 |
代為處理配合法國訴 |
|
公司 |
訟鑑定及調查所需協 |
|
法國 GROUPAMA LOIRE BRETAGNE 保險公 |
助。 |
|
司 |
2018.11.1 AON通知 |
|
l 被告:聯想電腦(NB 電腦主機賣方) |
敦南製造供應之 |
|
l 通知訴訟èFSP GROUP France 全漢企業(經銷商) |
GBU606組件,未被 |
|
l 被要求參與事故鑑定及分析調查通知è所有電源 |
視為本案事故起火 |
|
供應器組件製造商:凱勵電子/敦南科技/意法半導 |
源,目前仍等候法院 |
|
體/快捷半導體 |
調查專家之正式報告 |
|
l 敦南科技製造供應之組件為:DIODE, BRIDGE, |
中。 |
|
6A, 600V, GLASS, GBU606 |
||
l FSP 全漢台灣公司請求對所有電源供應器組件進 |
||
行失效模式效應與關鍵性分析,故參與後續司法 |
||
鑑定活動。 |
(2)A schedule of all proceedings by the Company presently pending, or which the Company intends to initiate against any person or company.
11
|
訴訟原由 |
目前狀況 |
#1 |
深圳人民法院-房東拒絕退還辦公室押金,故依請求返 還押租金 請求返還押租金:人民幣92,400元 |
一審勝訴,等候判決確 定後(預計8/8)強制執行 |
#2 |
新竹地院-因供應商-邦杰材料科技(股)公司提供之靶材 品質瑕疵,連帶造成公司晶片品質瑕疵,故依法請求 損害賠償 請求損害金額:新台幣4,066,271元 |
訴訟證據準備中即將提 出訴訟請求繫屬法院, 尚未進入訴訟程序 |
#3 |
重慶人民法院-原客戶(中航(重慶)微電子有限公司,後 併入華潤微電子(重慶)有限公司)未依訂單收貨,故向 法院依法請求解除合同&損害賠償 請求損害金額:美金164,545.34元 |
訴訟證據準備台灣公證 中,尚未進入訴訟程序 |
12
Section 4.13 – Restriction on Business Activities
|
(i) |
nil |
|
(ii) |
本公司透過子公司-Lite-on Semiconductor (HK) Limited與騏俊物聯(香港)有限公 司於2019年5月中簽定JV Agreement,雙方合資成立子公司-WBG PowerSystems (Cayman) Co., Ltd.,本公司佔有65%股權。依雙方簽訂之JV Agreement,未來一 方要出售股權時,另一方有優先購買之權利。 |
|
13
Section 4.14(a) – Material Contracts
(i)Loan agreements
Maturity Date |
Bank Name |
Value Date |
Int.Rate |
Curr. |
Principal |
合約 |
2019/07/04 |
IBFC |
2019/05/07 |
1.22% |
NTD |
100,000,000 |
委託保證商業本票
契約書 |
2019/07/12 |
CHANG HWA |
2019/06/13 |
1.18% |
NTD |
300,000,000 |
授信約定書 |
2019/07/12 |
CHANG HWA |
2019/06/28 |
1.18% |
NTD |
100,000,000 |
|
2019/07/17 |
CITIBANK |
2019/05/15 |
3.10% |
USD |
1,000,000 |
special credit support arrangement |
2019/07/26 |
FAR EASTERN |
2019/05/27 |
1.18% |
NTD |
400,000,000 |
授信/金融交易條
件契約書 |
2019/08/07 |
CITIBANK |
2019/06/05 |
3.10% |
USD |
2,000,000 |
special credit support arrangement |
2019/08/08 |
CITIBANK |
2019/06/06 |
3.10% |
USD |
3,000,000 |
|
2019/08/16 |
E.Sun |
2019/06/17 |
3.06% |
USD |
2,000,000 |
授信條件通知暨確
認書 |
2019/08/26 |
CITIBANK |
2019/06/24 |
3.10% |
USD |
3,000,000 |
special credit support arrangement |
2019/08/29 |
CITIBANK |
2019/06/27 |
3.10% |
USD |
1,000,000 |
|
2019/09/27 |
FUBON |
2019/04/03 |
1.18% |
NTD |
100,000,000 |
授信核定通知書 |
2019/10/23 |
FUBON |
2019/04/26 |
1.18% |
NTD |
250,000,000 |
|
2019/10/30 |
FUBON |
2019/05/03 |
1.18% |
NTD |
400,000,000 |
|
2019/11/20 |
MEGA |
2019/05/24 |
1.10% |
NTD |
100,000,000 |
綜合授信契約書 |
2019/11/27 |
MEGA |
2019/05/31 |
1.10% |
NTD |
50,000,000 |
|
2019/12/01 |
MEGA |
2019/06/04 |
1.10% |
NTD |
50,000,000 |
14
2019/12/10 |
MEGA |
2019/06/13 |
1.10% |
NTD |
100,000,000 |
|
2020/02/11 |
FUBON |
2016/08/11 |
1.80% |
NTD |
625,000,000 |
聯合授信合約書 |
2020/02/14 |
TACB |
2019/02/14 |
1.20% |
NTD |
100,000,000 |
企業授信綜合額度
契約書 |
2021/08/11 |
FUBON |
2016/08/11 |
1.80% |
NTD |
675,000,000 |
聯合授信合約書 |
2021/08/11 |
FUBON |
2016/08/22 |
1.80% |
NTD |
1,200,000,000 |
聯合授信合約書 |
|
(ii) |
lease agreement material to the operation of the Company |
承租人/Lessee |
出租人/Lessor |
Location |
Purpose |
Lite-On Semiconductor Corp. |
光寶科技股份有限
公司 |
光寶大樓4樓 |
敦南總部辦公室 |
Lite-On Semiconductor |
光寶科技股份有限 |
光寶大樓一樓Show |
敦南產品展示 |
Corp. |
公司 |
room部分空間 |
|
Lite-On Semiconductor Corp. |
柯賢琦、許偉莉 |
內湖里昂大樓十一樓 |
辦公室 |
Lite-On Semiconductor Corp. |
余曉霞 |
基金二路1巷26號1-3
樓 |
外勞宿舍 |
Lite-On Semiconductor Corp. |
林水源 |
基金二路1巷140號1-
3樓 |
外勞宿舍 |
Lite-On Semiconductor Corp |
科學工業園區管理 |
科園段科園小段地號 |
新竹一廠土地 |
Hsinchu Branch |
局 |
81 |
15
Lite-On Semiconductor Corp Hsinchu Branch |
科學工業園區管理
局 |
科園段科園小段地號
81-1 |
新竹二廠土地 |
Lite-On Semiconductor Corp Hsinchu Branch |
科學工業園區管理
局 |
科園段科園小段地號
80 |
新竹廠停車場土地 |
Lite-On Semiconductor Corp Hsinchu Branch |
鑫藝建設房屋 |
新竹市金山七街75號
A3F-2 |
外籍員工宿舍 |
Lite-On Semiconductor Corp Hsinchu Branch |
鑫藝建設房屋 |
新竹市金山七街75號
C4F-1 |
外籍員工宿舍 |
Lite-On Semiconductor Corp Hsinchu Branch |
何進洲 |
新竹縣寶山鄉大崎村
16鄰雙園路一段2巷
18弄1衖11號4樓 |
台籍主管宿舍 |
Shangai Seefull Electronic Co., Ltd. |
上海市國土資源局 |
上海市松江縣洞涇鎮
磚橋村松江90號地塊 |
上海廠土地 |
Shangai Seefull Electronic Co., Ltd. |
深圳市匯豐資產管 |
深圳市南山區高新南 |
Powersemi深圳業務 |
理有限公司 |
九道北科大廈1308單 |
辦公室 |
|
位 |
|||
Shangai Seefull Electronic Co., Ltd. |
力國企業發展(上 |
上海市吳寶路255號2 |
Powersemi上海業務 |
海)有限公司 |
樓203、205室 |
辦公室 |
|
Shangai Seefull Electronic Co., Ltd. |
鮑永友 |
上海市閔行區吳寶路
139弄16號401室 |
員工宿舍 |
16
Shangai Seefull Electronic Co., Ltd. |
陸亞林、鍾士華 |
洞涇鎮海欣城小區3
號樓1002 |
員工宿舍 |
Shangai Seefull Electronic Co., Ltd. |
鄧少剛 |
深圳市南山區深南大 道路與前海路交會處 星海名城五期3單元 9D |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
無錫市國土資源局 |
江蘇省無錫市珠江路
45號 |
無錫科技廠土地 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
過煒強 |
無錫市新區天山路2
號銀河廣場2-3-602室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
張勤仙 |
無錫市新區天山路2
號銀河廣場2-7-501室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
楊芳 |
無錫市新區天山路2
號銀河廣場2-2-502室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
馬建春 |
無錫市新區天山路2
號銀河廣場2-3-601室 |
員工宿舍 |
lite-on microelectronics (WUXI) Co., Ltd |
無錫市國土資源局 |
江蘇省無錫市出口加
工區J7J8地塊 |
無錫微電子廠土地 |
lite-on microelectronics (WUXI) Co., Ltd |
嚴春美 |
銀河國際2-6-202室 |
員工宿舍 |
17
lite-on microelectronics (WUXI) Co., Ltd |
閆靜靜 |
尚東雅園47-1502 |
員工宿舍 |
lite-on microelectronics |
無錫市新發企業管 |
泰山路南側、錫士路 |
員工宿舍 |
(WUXI) Co., Ltd |
理有限公司 |
西側、春豐路北側IC |
|
公寓13-301 |
|||
lite-on microelectronics |
無錫市新發企業管 |
泰山路南側、錫士路 |
員工宿舍 |
(WUXI) Co., Ltd |
理有限公司 |
西側、春豐路北側IC |
|
公寓10-602 |
|||
lite-on microelectronics (WUXI) Co., Ltd |
彭莉莉 |
尚東雅園45-2401 |
員工宿舍 |
Dyna Image Corp. Philippines |
Philippine Economic Zone Authority |
Lot 1&2 Blk. 24 Phase 4 PEZA Ecozone Rosario Cavite 4106 |
菲律賓廠土地 |
投資標的
投資型式
投資幣別
投資原幣金額
目前狀態
WBG PowerSystems (Cayman) Co., Ltd.
Joint venture
USD
1,950,000
本公司透過子公司 -
Lite-on Semiconductor
(中文名稱:寬頻芯
(HK) Limited與騏俊物
科技(開曼)有限公
聯 ( 香港 ) 有限公司於
司)
2019 年 5 月中簽定 JV
Agreement,雙方合資
joint venture, joint development, partnership, consortium or similar Contract with any third Person that is material to the business of the Company
18
成 立 子 公 司 -WBG
PowerSystems (Cayman) Co., Ltd.,目
前 Cayman 公司已設 立,近期將注資,總投 資金額USD 3,000,000,
本公司佔65%。
(iv)Significant Customers
|
Segment |
Category |
|
LITE-ON GROUP |
Discrete、IC |
End customer |
跟end customer只會簽品質保 證合約等,並不會簽銷售合 約,而以PO代替 |
DELTA ELECTRONICS Group |
Discrete |
End customer |
採購合約書 |
STMicroelectronics Pte Ltd. |
Discrete |
End customer |
subcontract agreement |
DIODES GROUP |
Discrete |
End customer |
沒有簽訂正式合約,雙方是 以報價單及訂單視同合約方 式交易 |
Avent (Taiwan) |
Discrete |
Distributor |
distribution agreement |
ATM Electronics (聚興科 技) |
Discrete、IC |
Distributor |
standard terms and conditions of sale |
晟威股份有限公司 |
Discrete |
Distributor |
standard terms and conditions of sale |
Sunrisetek co., Ltd. (晨昕 科技) |
Discrete、IC |
Distributor |
standard terms and conditions of sale |
Lumax International Corp. Ltd. (巨路國際) |
Discrete、IC |
Distributor |
standard terms and conditions of sale |
KENJET TECHNOLOGY CO., LTD |
Discrete、IC |
Distributor |
以PO方式進行交易 |
|
(v) |
Significant Suppliers |
No. |
Supplier |
Purchased |
|
19
L&K Industries Phils.,Inc. |
Sensor Board, Mono CIS |
Subcontractor agreement |
|
2. |
Ningbo Gangbo Electronics Co., |
Lead Frame, Clip |
|
20
|
Ltd. (寧波港波電子有限公司) |
|
所述原物料供應商均為 |
合格供應商,是依據 |
|||
3. |
Episil-Precision Inc. (嘉晶電子股份有限公司). |
EPI, EPI Wafer |
|
《採購及供應商管理作 |
|||
業程序》進行作業,目 |
|||
前主要依據 A.品質協 |
|||
4. |
Shanghai Simgui Technology Co.,Ltd |
EPI |
|
議書 B.供應商報價單 |
|||
5. |
Lite-On Japan (H.K.) LTD., |
ROD LENS, NSG FPC LED |
C.PO 明確雙方的責任 |
要求及發生問題處理約 |
|||
6. |
Chang Chun (Changshu) Co., Ltd. (長春封塑料(常熟)有限公
司) |
黑膠 |
定等, |
因此與原物料供應商之 |
|||
間沒有再簽訂採購合約 |
|||
書。 |
|||
7. |
Jlin Magic Semiconductor Co.,Ltd. |
Wafer |
|
8. |
Bondtron Electronics (邦壯電
子) |
Lead Frame, Clip |
|
9. |
LRC Taiwan Co., Ltd |
Power Semi外包廠
商, REEL |
外購成品及加工服務合
約 |
10. |
Siltronic Singapore Pte. Ltd. |
Wafer |
所述原物料供應商均為 合格供應商,是依據 《採購及供應商管理作 業程序》進行作業,目 前主要依據 A.品質協 議書 B.供應商報價單 C.PO 明確雙方的責任 要求及發生問題處理約 定等, 因此與原物料供應商之 |
20
|
|
|
間沒有再簽訂採購合約
書。 |
|
(vi) |
nil |
|
(vii) |
nil |
|
(viii) |
nil |
|
(ix) |
(a) |
依姓筆劃排序 |
合約 |
江協龍 |
X |
李朝福 |
X |
陳永峰 |
V |
黃碧琴 |
X |
黎世宏 |
X |
|
(b) |
nil |
(c) |
nil |
|
(x) |
nil |
|
(xi) |
nil |
|
(xii) |
nil |
|
(xiii) |
nil |
|
(xiv) |
nil |
|
21
Section 4.15 – Tax Matters
項次
Item |
發生事項
Issue |
說明
Remark |
1. |
敦南無錫微電子因營業利潤較低,被無錫新區 |
自2015年迄今,敦南科技 |
國稅局查核轉撥計價(Transfer Price),查核期 |
大陸3家子公司皆未被大陸 |
|
間為2010年至2013年,並於2015年8月底定案 |
國稅局查核轉撥計價。 |
|
及結案=>被無錫新區國稅局追繳所得稅約 |
The three subsidiaries of Lite-On Semiconductor |
|
RMB1.6M。 |
Corp. have not been audited the Transfer Price by China |
|
Due to its low operating profit, Lite-on |
Taxation Bureau since |
|
microelectronics (WUXI) Co., Ltd. was audited |
September 2015 . |
|
the Transfer Price by Wuxi New District Taxation |
||
Bureau. The audit period was from 2010 to 2013. |
||
Lite-on microelectronics (WUXI) Co., Ltd had |
||
paid income tax approximately RMB1.6M to |
||
Wuxi New District Tax bureau. This Transfer |
||
Price issue was finalized and closed at the end of |
||
August 2015. |
22
Section 4.16(a) – Company Employee Plans
公司員工福利政策彙總
No |
項目 |
1 |
教育訓練 |
2 |
勞工保險與健康保險 |
3 |
員工福利 |
4 |
婚喪賀儀補助 |
5 |
主管公務座車管理辦法 |
6 |
團體保險 |
7 |
健康檢查補助 |
8 |
職工福利委員會 |
|
|
|
|
23
Section 4.16(b)(ii) – Legal Proceedings Relating to Company Employee Plans
Nil
24
Section 4.16(d) – Compliance with Labor Laws
Nil
25
Section 4.17(a) –Intellectual Property Not Wholly-Owned by the Company Group
Nil
26
Section 4.17(c) – Legal Proceedings Relating to Intellectual Property
Nil
27
Section 4.17(d) – Violations of Employee Confidentiality Obligations
Nil
28
Section 4.17(e) – Company Registered Intellectual Property
權利人:敦南科技(股)公司
|
案件名稱(中文) |
國家 |
申請日期 |
專利權(起) |
專利權(迄) |
1 |
均勻光產生結構 |
大陸 |
2009/4/28 |
2009/4/28 |
2019/4/28 |
2 |
具數位訊號輸出之接觸式影 像感測裝置及其訊號輸出方 法 |
日本 |
2005/3/25 |
2005/3/25 |
2025/3/25 |
3 |
具抗雜訊干擾之光感測裝置 |
中華民國 |
2005/12/9 |
2007/11/1 |
2025/12/8 |
4 |
均勻光產生結構 |
中華民國 |
2009/3/20 |
2009/8/11 |
2019/3/19 |
5 |
數位接觸式影像感測器之裝
置與控制方法 |
中華民國 |
2004/3/24 |
2005/8/1 |
2024/3/23 |
6 |
具數位訊號輸出之接觸式影 像感測裝智及其訊號輸出方 法 |
美國 |
2005/8/3 |
2005/8/3 |
2025/12/8 |
7 |
過電壓保護裝置及其製造方
法 |
中華民國 |
2004/2/17 |
2006/1/1 |
2024/2/16 |
8 |
過電壓保護裝置及其製程 |
大陸 |
2004/3/8 |
2004/3/8 |
2024/3/8 |
9 |
過電壓保護裝置及其製程 |
美國 |
2004/4/30 |
2004/4/30 |
2024/4/30 |
10 |
閘流體元件及其製造方法 |
中華民國 |
2012/5/4 |
2015/3/1 |
2032/5/3 |
29
11 |
閘流體元件及其製造方法
(基隆) |
大陸 |
2012/5/17 |
2012/5/17 |
2032/5/17 |
12 |
閘流體元件及其製造方法
(基隆) |
美國 |
2012/10/19 |
2012/10/19 |
2032/10/22 |
13 |
橋式整流器以及其製造方法 |
中華民國 |
2013/4/15 |
2015/10/21 |
2033/4/14 |
14 |
橋式整流器以及其製造方法 |
大陸 |
2013/4/24 |
2013/4/24 |
2033/4/24 |
15 |
橋式整流器以及其製造方法 |
美國 |
2013/7/5 |
2013/7/5 |
2033/7/5 |
16 |
雙溝槽式的功率半導體元件
及其製造方法 |
中華民國 |
2014/8/20 |
2016/2/1 |
2034/8/19 |
17 |
二極體元件及其製造方法 |
中華民國 |
2015/11/20 |
2017/4/1 |
2035/11/19 |
18 |
功率二極體元件 |
中華民國 |
2016/3/14 |
2017/5/11 |
2036/3/13 |
19 |
超接面半導體元件 |
美國 |
2016/4/25 |
2016/4/25 |
2036/4/25 |
權利人:敦南微電子(無錫)有限公司
|
题目 |
专利类型 |
备注(申请号) |
授权公告日 |
有效期 |
1 |
一种监控点胶胶量的装置 |
实用新型 |
201520879427.3 |
2016-4-13 |
2025年 |
2 |
共用型两片式整流桥引线框架
结构 |
实用新型 |
201620493788.9 |
2016-12-7 |
2025年 |
3 |
高导热焊线封装桥式整流器 |
实用新型 |
201621266375.3 |
2017-6-13 |
2026年 |
4 |
高导热大功率桥式整流器结构 |
实用新型 |
201621265972.4 |
2017-5-31 |
2026年 |
30
5 |
用于自动高压测试仪的绝缘测
试轨道 |
实用新型 |
201020145213.0 |
2010-11-3 |
2019年 |
6 |
超薄微型桥堆整流器 |
实用新型 |
201220730177.3 |
2013-6-26 |
2021年 |
7 |
半导体器件去除残胶的平脚结
构 |
实用新型 |
201220572969.2 |
2013-5-29 |
2021年 |
8 |
超薄微型桥堆整流器 |
实用新型 |
201210575976.2 |
2016-4-13 |
2035年 |
9 |
一种带散热片的高功率桥式整
流器 |
实用新型 |
201820155449.9 |
2018/9/14 |
2027年 |
10 |
一种大功率薄型贴片式桥堆整
流器 |
实用新型 |
201820001499.1 |
2018/9/28 |
2027年 |
11 |
一种TO220双排式引线框架结构 |
实用新型 |
201820156256.5 |
2018/9/28 |
2027年 |
12 |
高导热大功率桥式整流器结构 |
发明专利 |
201611044545.8 |
发明专利
实质审查 |
|
13 |
一种大功率薄型贴片式桥堆整
流器 |
发明专利 |
201810001243.5 |
发明专利
实质审查 |
|
權利人:上海旭福電子有線公司
|
题目 |
专利类型 |
备注(申请号) |
授权公告日 |
有效期 |
1 |
芯片装填装置 |
实用新型 |
201020151356.2 |
2010-11-3 |
2019年 |
2 |
新型半导体导线跳线结构 |
实用新型 |
201020553865.8 |
2011-5-18 |
2019年 |
31
3 |
瞬变电压抑制二极管和肖特基
二极管组合的晶体管 |
实用新型 |
201120050564.8 |
2011-8-31 |
2020年 |
4 |
超薄贴装二极管SMD的平角封
装结构 |
实用新型 |
201120123059.1 |
2011-11-16 |
2020年 |
5 |
表面贴装元器件跳线的集合拼
板 |
实用新型 |
201320315382.8 |
2013-12-4 |
2022年 |
6 |
贴片元器件的导胶槽 |
实用新型 |
201320315652.5 |
2013-12-4 |
2022年 |
7 |
跳线与支架的凹凸互配结构 |
实用新型 |
201320402491.3 |
2014-4-2 |
2022年 |
8 |
增大晶体管晶粒触发极跳线焊
接面积的封装结构 |
实用新型 |
201420833300.3 |
2015-4-29 |
2024年 |
9 |
一种剔出芯片点测过程中不良
晶粒的装置 |
实用新型 |
201520153191.5 |
2015-7-15 |
2024年 |
10 |
自动焊接设备的切筋模具 |
实用新型 |
201720938093.1 |
2018-2-13 |
2027年 |
11 |
一种清洗半导体焊接炉内废焊
油的清理工具 |
实用新型 |
201820275559.9 |
授权审查中 |
權利人:敦南科技(無錫)有限公司
|
题目 |
专利类型 |
备注(申请号) |
授权公告日 |
有效期 |
1 |
一种玻璃钝化器件光刻机的自
动对位装置 |
实用新型 |
201420279753.6 |
2014-10-29 |
2024年 |
32
2 |
一种控制液体滴液量的装置 |
实用新型 |
201620116051.5 |
2016-8-31 |
2025年 |
3 |
一种采用电解工艺清除晶片表
面磷硅-硼硅玻璃氧化层的夹具 |
实用新型 |
201820317731.2 |
2018/9/14 |
2027年 |
4 |
一种新型的晶圆镀膜片光罩清
洗工艺 |
发明专利 |
201410818887.5 |
发明专利
实质审查 |
|
5 |
接触式影像传感器 |
实用新型 |
證書已發行 |
||
6 |
光源发光模组 |
实用新型 |
|||
7 |
图像传感器 |
实用新型 |
|||
8 |
注胶机 |
实用新型 |
|||
9 |
光电探测器 |
发明 |
|||
10 |
一种光源组件 |
发明 |
|||
11 |
抽管式外壳 |
发明 |
|||
12 |
一种含镍废水的处理系统 |
新型 |
|||
13 |
一种紫外光源增益模组 |
新型 |
|||
14 |
侧入式发光二级管照明增益模
组 |
新型 |
|||
15 |
一种超微举增亮膜及光源增益
模组 |
发明 |
申請中 |
||
16 |
一种超薄型影像传感器模块 |
新型发明 |
申請中 |
33
17 |
同抽光照射型接触式影像传感
器模块 |
新型发明 |
申請中(已授權) |
34
Section 4.17(f) – Orders Relating to Company Intellectual Property Rights
Nil
35
Section 4.17(g) – Material Violations of Company IP Licenses
Nil
36
Section 4.20(a) – Owned Real Property
Lite On Semiconductor Corp. and subsidiaries owned real property list.
Company |
Location |
Own |
Address |
Description |
Lite-On Semiconductor Corp. |
Kelung Taiwan |
Land Building |
基隆市大武崙 |
Manufacturing Factory |
工業區武訓街 |
||||
28-1號 |
||||
Lite-On Semiconductor Corp. |
Hsinchu Taiwan |
Building |
新竹市科學工 |
Manufacturing Factory |
業園區工業東 |
||||
七路7號一廠 |
||||
Lite-On Semiconductor Corp. |
Hsinchu Taiwan |
Building |
新竹市科學工 |
Investment Property |
業園區工業東 |
||||
七路7號二廠 |
||||
Lite-On Semiconductor Corp. |
Hsinchu Taiwan |
Building |
新竹市科學工 業園區工業東 七路7號 |
Parking Lot |
Lite-On Semiconductor Corp. |
Nankang Taiwan |
Land Building |
台北市南港區 |
Investment Property |
三重路19-5號9 |
||||
樓 |
||||
Shanghai Seefull Electronic Co. Ltd |
Shanghai China |
Building |
上海市松江區 |
Manufacturing Factory |
洞涇鎮振業路6 |
37
|
|
|
號 |
|
Lite-On Semiconductor (WUXI) Co., Ltd. |
Wuxi China |
Building |
江蘇省無錫市
珠江路45號 |
Manufacturing Factory |
lite-on microelectronics (WUXI) Co.,Ltd |
Wuxi China |
Building |
江蘇省無錫市 出口加工區J7J8 地塊 |
Manufacturing Factory |
Dyna Image Corp. Philippines |
Philippines |
Building |
Lot 1&2 Blk. 24 Phase 4 PEZA Ecozone Rosario Cavite 4106 |
Factory |
38
Section 4.20(a)(A) – Marketable Title to Owned Real Property
Nil
39
Section 4.20(b) – Leased Real Property
Lite-On Semiconductor Corp. and subsidiaries leasing real property list.
承租人/Lessee |
出租人/Lessor |
Location |
Purpose |
Lite-On Semiconductor Corp. |
光寶科技股份有限
公司 |
光寶大樓4樓 |
敦南總部辦公室 |
Lite-On Semiconductor |
光寶科技股份有限 |
光寶大樓一樓Show |
敦南產品展示 |
Corp. |
公司 |
room部分空間 |
|
Lite-On Semiconductor Corp. |
柯賢琦、許偉莉 |
內湖里昂大樓十一樓 |
辦公室 |
Lite-On Semiconductor Corp. |
余曉霞 |
基金二路1巷26號1-3
樓 |
外勞宿舍 |
Lite-On Semiconductor Corp. |
林水源 |
基金二路1巷140號1-
3樓 |
外勞宿舍 |
Lite-On Semiconductor Corp |
科學工業園區管理 |
科園段科園小段地號 |
新竹一廠土地 |
Hsinchu Branch |
局 |
81 |
|
Lite-On Semiconductor Corp |
科學工業園區管理 |
科園段科園小段地號 |
新竹二廠土地 |
Hsinchu Branch |
局 |
81-1 |
|
Lite-On Semiconductor Corp |
科學工業園區管理 |
科園段科園小段地號 |
新竹廠停車場土地 |
Hsinchu Branch |
局 |
80 |
|
Lite-On Semiconductor Corp Hsinchu Branch |
鑫藝建設房屋 |
新竹市金山七街75號
A3F-2 |
外籍員工宿舍 |
40
Lite-On Semiconductor Corp Hsinchu Branch |
鑫藝建設房屋 |
新竹市金山七街75號
C4F-1 |
外籍員工宿舍 |
Lite-On Semiconductor Corp Hsinchu Branch |
何進洲 |
新竹縣寶山鄉大崎村
16鄰雙園路一段2巷
18弄1衖11號4樓 |
台籍主管宿舍 |
Shangai Seefull Electronic Co., Ltd. |
上海市國土資源局 |
上海市松江縣洞涇鎮
磚橋村松江90號地塊 |
上海廠土地 |
Shangai Seefull Electronic Co., Ltd. |
深圳市匯豐資產管 |
深圳市南山區高新南 |
Powersemi深圳業務 |
理有限公司 |
九道北科大廈1308單 |
辦公室 |
|
位 |
|||
Shangai Seefull Electronic Co., Ltd. |
力國企業發展(上 |
上海市吳寶路255號2 |
Powersemi上海業務 |
海)有限公司 |
樓203、205室 |
辦公室 |
|
Shangai Seefull Electronic Co., Ltd. |
鮑永友 |
上海市閔行區吳寶路
139弄16號401室 |
員工宿舍 |
Shangai Seefull Electronic Co., Ltd. |
陸亞林、鍾士華 |
洞涇鎮海欣城小區3
號樓1002 |
員工宿舍 |
Shangai Seefull Electronic Co., Ltd. |
鄧少剛 |
深圳市南山區深南大 道路與前海路交會處 星海名城五期3單元 9D |
員工宿舍 |
41
Lite-On Semiconductor (WUXI) Co., Ltd. |
無錫市國土資源局 |
江蘇省無錫市珠江路
45號 |
無錫科技廠土地 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
過煒強 |
無錫市新區天山路2
號銀河廣場2-3-602室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
張勤仙 |
無錫市新區天山路2
號銀河廣場2-7-501室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
楊芳 |
無錫市新區天山路2
號銀河廣場2-2-502室 |
員工宿舍 |
Lite-On Semiconductor (WUXI) Co., Ltd. |
馬建春 |
無錫市新區天山路2
號銀河廣場2-3-601室 |
員工宿舍 |
lite-on microelectronics (WUXI) Co., Ltd |
無錫市國土資源局 |
江蘇省無錫市出口加
工區J7J8地塊 |
無錫微電子廠土地 |
lite-on microelectronics (WUXI) Co., Ltd |
嚴春美 |
銀河國際2-6-202室 |
員工宿舍 |
lite-on microelectronics (WUXI) Co., Ltd |
閆靜靜 |
尚東雅園47-1502 |
員工宿舍 |
lite-on microelectronics (WUXI) Co., Ltd |
無錫市新發企業管 理有限公司 |
泰山路南側、錫士路 西側、春豐路北側IC 公寓13-301 |
員工宿舍 |
lite-on microelectronics |
無錫市新發企業管 |
泰山路南側、錫士路 |
員工宿舍 |
42
(WUXI) Co., Ltd |
理有限公司 |
西側、春豐路北側IC
公寓10-602 |
|
lite-on microelectronics (WUXI) Co., Ltd |
彭莉莉 |
尚東雅園45-2401 |
員工宿舍 |
Dyna Image Corp. Philippines |
Philippine Economic Zone Authority |
Lot 1&2 Blk. 24 Phase 4 PEZA Ecozone Rosario Cavite 4106 |
菲律賓廠土地 |
43
Section 4.21(a) – Environmental Law Compliance
敦南科技(股)公司
項目 |
說明 |
nil |
敦南微電子(無錫)有限公司
項目 |
說明 |
1 |
不符合VOCs總量控制的要求,需提升 |
上海旭福電子有線公司
項目 |
說明 |
1 |
廢水中的鎳含量問題及廢水的鎳含量在線監測 |
2 |
酸性廢氣、VOCs及廢水站的提標改造及危廢存放區的 整體改造 |
3 |
擴產環境影響評估 |
4 |
廢液排放管滲漏 |
5 |
安全生產雙重預防機制建立 |
6 |
甲類化學品倉庫未報驗及特氣房之安全規範 |
敦南科技(無錫)有限公司
項目 |
說明 |
1 |
廢水中的鎳含量問題 |
2 |
VOCs的提標改造(不符合VOCs總量控制的要求,需提 升) |
3 |
廢水的二次沉澱改造 |
4 |
消防系統整體改造 |
44
Section 4.21(b) – Environmental Permits
敦南科技(股)公司基隆廠
項目 |
證照 |
1 |
工廠登記證 |
2 |
固定汙染源操作許可證 |
3 |
毒性化學物質核可文件 |
敦南科技(股)公司新竹分公司
項目 |
證照 |
1 |
科學工業園區管理局工廠登記核准函 |
2 |
固定汙染源操作許可證 |
3 |
毒性化學物質核可文件 |
4 |
水污染防治許可證 |
敦南微電子(無錫)有限公司
項目 |
證照 |
備註 |
1 |
營業執照_正本 |
2016/10/1五證合一後,營業執照取代組織機構代碼
證、稅務登記證、社會保險登記證和統計登記證 |
2 |
營業執照_副本 |
|
3 |
批准證書_正本 |
|
4 |
批准證書_副本 |
|
5 |
機構信用代碼證 |
|
45
6 |
開戶許可證 |
|
7 |
不動產權證書 |
|
8 |
自理報關單位注冊證書 |
|
權利人:上海旭福電子有線公司
項目 |
證照 |
備註 |
1 |
營業執照_正本 |
2016/10/1五證合一後,營業執照取代組織機構代碼
證、稅務登記證、社會保險登記證和統計登記證 |
2 |
營業執照_副本 |
|
3 |
批准證書_正本 |
|
4 |
批准證書_副本 |
|
5 |
機構信用代碼證 |
|
6 |
開戶許可證 |
|
7 |
報關單位注冊登記證 |
|
8 |
土地使用權證 |
|
9 |
上海市房地產權證 |
|
權利人:敦南科技(無錫)有限公司
項目 |
證照 |
備註 |
1 |
營業執照_正本 |
2016/10/1五證合一後,營業執照取代組織機構代碼
證、稅務登記證、社會保險登記證和統計登記證 |
2 |
營業執照_副本 |
46
3 |
批准證書_正本 |
|
4 |
批准證書_副本 |
|
5 |
機構信用代碼證 |
|
6 |
開戶許可證 |
|
7 |
不動產權證書 |
|
8 |
出口企業退稅登記證 |
|
9 |
報關單位備案登記證明書 |
|
10 |
自理報檢單位備案證明書 |
|
11 |
自理報關單位報關備案證
明書 |
|
47
Section 4.21(c) – Legal Proceedings Relating to Environmental Law
敦南科技(無錫)有限公司於2018年12月初發生工安事件造成人員傷亡(1死1輕傷),相關 賠償責任及罰款業已處理完畢,惟依中華人民共和國安全生產法第90條之規定,發生 事故,對負有責任的單位除要求其依法承擔相應的賠償等責任外,依照下列規定處以 罰款:
(一)發生一般事故,處10萬元以上,20萬元以下罰款; (二)發生較大事故,處20萬元以上,50萬元以下罰款; (三)發生重大事故,處50萬元以上,200萬元以下罰款。
Note:公司業已針對此條法令估列可能罰款20萬入帳。
48
Section 4.22 – Insurance
Lite-On Semiconductor Corp. and subsidiaries Insurance summary
保險險種 |
保險內容 |
總保額 |
保費 |
D&O |
承保過去及現在所有 董事經理人因不當行 為遭第三人求償而生 之賠償責任、律師費 用及相關合理必要費 用。 |
US$40,000,000 |
Year 2019 US$14,035 |
Commercial General Liability Insurance |
承保因被保險人之業 |
US$30M每一事 |
Year 2019: US$24,057 |
(CGL商業綜合責任 |
務執行 (包括營運處 |
故; US$45M 年度 |
|
保險) |
所、營業行為及提供 |
累積 |
|
的產品及服務) 導致意 |
|||
外事故,造成第三人 |
|||
體傷財損,而遭第三 |
|||
人求償而生之法律賠 |
|||
償責任及相關合理必 |
|||
要抗辯費用。 |
|||
Commercial Fire Insurance(商業火災 |
承保除保單列名不保 |
US$568,395,417 |
Year 2019: US$224,820 |
事項外,因其他各項 |
49
綜合保險) |
危險事故(火災、閃電 |
|
|
雷擊、天災…等)之發 |
|||
生,致保險標的物發 |
|||
生之損失。 |
|||
Stock Throughput Insurance Policy (全 |
承保原物料/成品/半成
品於運送途中及儲存 |
運送/儲存保額: US$5,000,000 |
Year 2019: US$28,349.39 |
球貨物流動保險) |
|
||
期間,因發生自然事 |
|||
故或意外災害,所導 |
|||
致承保標的物的毀損 |
|||
或滅失。 |
註:敦南所有保險皆是包含於光寶集團之保單內。
50
Section 4.23 – Significant Customers
Lite-On Semiconductor Corp. and subsidiaries Top 10 Customer
No. |
Customer |
Remark |
1. |
LITE-ON GROUP |
Includes: 光寶貿易有限公司, LITE-ON JAPAN (H.K.) LTD., LITE-ON OVERSEAS TRADING CO., LTD., LITE-ON SINGAPORE PTE LTD., LITE- ON JAPAN LTD., 光寶科技(常州)有限 公司, LITE-ON JAPAN (THAILAND) CO., LTD, LITE-ON ELECTRONICS (THAILAND) CO.,LTD., LITE-ON SINGAPORE PTE LTD, LITE-ON TECHNOLOGY CORPORATION, 光寶 科技股份有限公司 |
2. |
DELTA ELECTRONICS Group |
Includes: DELTA ELECTRONICS INT'L (SINGAPORE) PTE. LTD. COMPANY, DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED, 台達電 子工業股份有限公司, DELTA ELECTRONICS INDIA PRIVATE LIMITED |
3. |
STMicroelectronics Pte Ltd. |
|
4. |
DIODES GROUP |
Includes: DIODES HONG KONG LIMITED, 盧森堡商達爾國際股份有限
公司台灣分公司, 上海凱虹科技電子有 限公司, 上海凱虹電子有限公司, DIODES TECHNOLOGY(CHENG DU) COMPANY LIMITED, DIODES ZETEX SEMICONDUCTORS LTD, DIODES INCORPORATED |
5. |
Avent (Taiwan) |
|
6. |
ATM Electronics (聚興科技) |
|
7. |
晟威股份有限公司 |
|
51
8. |
Sunrisetek co., Ltd. (晨昕科技) |
|
9. |
Lumax International Corp. Ltd. (巨路國
際) |
|
10. |
KENJET TECHNOLOGY CO., LTD |
|
52
Section 4.24 – Significant Suppliers
Lite-On Semiconductor Corp. and subsidiaries Top 10 Suppliers
No. |
Supplier |
Purchased |
1. |
L&K Industries Phils.,Inc. |
Sensor Board, Mono CIS |
2. |
Ningbo Gangbo Electronics Co., Ltd. (寧波港波電子有限公司) |
Lead Frame, Clip |
3. |
Episil-Precision Inc. (嘉晶電子股份有限公司). |
EPI, EPI Wafer |
4. |
Shanghai Simgui Technology Co.,Ltd |
EPI |
5. |
Lite-On Japan (H.K.) LTD., |
ROD LENS, NSG FPC LED |
6. |
Chang Chun (Changshu) Co., Ltd. (長春封塑料(常熟)有限公
司) |
黑膠 |
7. |
Jlin Magic Semiconductor Co.,Ltd. |
Wafer |
8. |
Bondtron Electronics (邦壯電
子) |
Lead Frame, Clip |
9. |
LRC Taiwan Co., Ltd |
Power Semi外包廠商, REEL |
10. |
Siltronic Singapore Pte. Ltd. |
Wafer |
1
Exhibit 99.1
Diodes Incorporated to Acquire Lite-On Semiconductor Corporation
Cash-based Share Swap Transaction Valued at Approximately $428 Million for Lite-On Semiconductor’s $230 Million in TTM Revenue and Approximately $91 Million of Cash Equivalents as of June 30, 2019
Plano, Texas and Taipei, Taiwan – August 8, 2019 - Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, and Lite-On Semiconductor Corporation (TWSE: 5305) (“LSC”), a Taiwan-based supplier of “green” power-related discrete and analog semiconductor devices, today announced the companies have entered into an agreement that provides for the acquisition of LSC by Diodes.
Highlights of the proposed transaction include:
|
• |
Combined trailing twelve months (“TTM”) reported revenue of approximately $1.5 billion and positive EBITDA of $333.1 million; |
|
• |
Represents next significant step in executing Diodes’ strategic growth plan to achieve $2.5 billion in revenue by 2025; |
|
• |
Broadens Diodes’ discrete and bipolar IC product offerings in Asia with a complementary product portfolio that will benefit from Diodes’ more extensive worldwide sales channel; |
|
• |
Offers cost-effective wafer fab and product assembly manufacturing capacity, enabling internal sourcing flexibility; |
|
• |
Favorable return on investment for LSC’s 31.2% ownership stake in On-Bright Electronics (TWSE: 4947); |
|
• |
Accelerates repurchase of Diodes’ shares outstanding, recapturing LSC’s holding of 15.3% of DIOD shares as of June 30, 2019; |
|
• |
Expected to result in financial synergies, including operational, manufacturing and administrative efficiencies; and |
|
• |
Expected to be immediately accretive to Diodes’ GAAP earnings per share. |
At the effective date of the transaction, each share of LSC stock will be converted into the right to receive TWD 42.50 in cash, or $1.37 USD, as of June 30, 2019 without interest. The aggregate consideration will be approximately $428 million. The price per share reflects a premium of 35% over LSC’s 30-day volume-weighted average price (VWAP). The boards of both companies have approved the transaction, which is still subject to approval by LSC shareholders as well as other customary closing conditions and regulatory approvals. The transaction is expected to close in April, 2020.
Commenting on the transaction, Dr. Keh-Shew Lu, President and Chief Executive Officer of Diodes, stated, “In combination with our strong organic growth, this proposed acquisition underscores Diodes’ use of acquisitions to accelerate the attainment of our next strategic goal of $2.5 billion in annual revenue and $1.0 billion in annual gross profit by 2025. This transaction will expand our discrete business in Asia, complementing our existing product lines with offerings at additional price points, especially for cost-sensitive applications. LSC’s contact image sensor business also extends Diodes’ footprint, representing a new market where Diodes can participate. Additionally, LSC’s wafer fabs and assembly sites provide Diodes with incremental manufacturing capacity as well as the opportunity for increased manufacturing flexibility and cross-regional internal dual-sourcing.”
Dr. Lu continued, “Further, this acquisition accelerates our share repurchase activities, recapturing over 15.3% of Diodes outstanding shares currently held by LSC. In addition, it provides a positive return on investment for LSC’s 31.2% ownership in On-Bright Electronics. The transaction also meets our criteria for strategic acquisitions and is expected to be immediately accretive to our earnings. We look forward to further leveraging Diodes’ strong manufacturing know-how to drive increased operational and cost efficiencies, while also improving utilization of LSC’s production facilities in Taiwan and China.”
Commenting on the proposed acquisition, David Lee, LSC President said, “We are pleased to have reached this agreement as Diodes offers us a significant opportunity to leverage their extensive sales channel, manufacturing strength and broad support infrastructure. We believe this transaction represents outstanding value for our shareholders, customers and employees alike, and we look forward to becoming a part of Diodes.”
Diodes expects to fund the purchase price of the acquisition primarily with proceeds from a new financing arrangement co-led by Bank of America, PNC Bank and Wells Fargo Securities. Advisors for the transaction included Jones Day, who served as legal counsel to Diodes and Lexcel Partners, legal counsel for LSC.
Conference Call and Slide Presentation Information
Diodes will host a conference call today at 4:00 p.m. Central Time (5:00 p.m. Eastern Time). This conference call will be broadcast live over the Internet with a slide presentation and can be accessed by all interested parties on the Investor section of Diodes' website at http://www.diodes.com. Please click on the Conference Call link at least fifteen minutes prior to the start of the call to register, download and install any necessary audio software.
When: Thursday, August 8, 2019
Time: 4:00 p.m. CT / 5:00 p.m. ET
Dial in: 1-855-232-8957; outside the U.S. +1-315-625-6979
Participant Code: 6687017
Live Webcast: http://investor.diodes.com
For those unable to participate during the live broadcast, a replay will be available shortly after the call and will be available on Diodes' website. The replay number is 1-855-859-2056 with a pass code of 6687017. International callers should dial +1-404-537-3406 and enter the same pass code at the prompt.
Further details of the transaction and arrangement are set out in Diodes’ Current Report on Form 8-K filed with the Securities and Exchange Commission on August 8, 2019.
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor’s SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality, application-specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets. We serve the consumer electronics, computing, communications, industrial, and automotive markets. Our products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors, power management devices, including LED drivers, AC-DC converters and controllers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes also has timing, connectivity, switching, and signal integrity solutions for high-speed signals. Our corporate headquarters and Americas’ sales offices are located in Plano, Texas and Milpitas, California. Design, marketing, and engineering centers are located in Plano; Milpitas; Taipei, Taoyuan City and Zhubei City, Taiwan; Oldham, England; and Neuhaus, Germany. Our wafer fabrication facilities are located in Oldham and Shanghai, China and Greenock, Scotland. We have assembly and test facilities located in Shanghai, Jinan and Chengdu, China, as well as in Hong Kong, Neuhaus and Taipei. Additional engineering, research and development, sales, warehouse, and logistics offices are located in Taipei; Hong Kong; Oldham; Shanghai; Shenzhen and Yangzhou, China; Seongnam-si, South Korea; Munich, Germany; and Tokyo, Japan, with support offices throughout the world.
Recent news releases, annual reports and SEC filings are available at the Company’s website: http://www.diodes.com. Written requests may be sent directly to the Company, or they may be e-mailed to: diodes-fin@diodes.com.
Forward-Looking Statements for Diodes
Safe Harbor Statement Under the Private Securities Litigation Reform Act of 1995: Any statements set forth herein that are not historical facts are forward-looking statements that involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Such forward-looking statements include, but are not limited to, the following: the expected benefits of the acquisition, including the acquisition being immediately accretive; the efficiencies, cost savings, revenues, and enhanced product offerings, market position, and design and manufacturing capabilities of Diodes after the acquisition; and other statements identified by words such as “estimates,” “expects,” “projects,” “plans,” “will,” and similar expressions.
Potential risks and uncertainties include, but are not limited to, such factors as: the possibility that the transaction may not be consummated, including as a result of any of the conditions precedent; the risk of superior acquisition proposal from other parties; the risk of Diodes being unable to obtain sufficient financing from lenders to complete the acquisition; the risk of global market downturn conditions and volatilities impacting the completion of the acquisition or the funding; the risk that such expectations may not be met; the risk that the expected benefits of the acquisition may not be realized or that integration of the acquired business may not be as rapid as we anticipate; the risk that Lite-On’s business will not be integrated successfully into Diodes’; the risk that the expected benefits of the acquisition may not be realized, including the realization of the accretive effect of the acquisition; the risk that Lite-On’s standards, procedures, and
controls will not be brought into conformance within Diodes’ operation; difficulties coordinating Diodes’ and Lite-On’s new product and process development, hiring additional management and other critical personnel, and increasing the scope, geographic diversity, and complexity of Diodes’ operations; difficulties in consolidating facilities and transferring processes and know-how; difficulties in reducing the cost of Lite-On’s business; the diversion of our management’s attention from the management of our business; Diodes may not be able to maintain its current growth strategy or continue to maintain its current performance, costs, and loadings in its manufacturing facilities; risks of domestic and foreign operations, including excessive operation costs, labor shortages, higher tax rates, and Diodes’ joint venture prospects; the risk that we may not be able to increase our automotive, industrial, or other revenue and market share; the risks of cyclical downturns in the semiconductor industry and of changes in end-market demand or product mix that may affect gross margin or render inventory obsolete; the risk that our future outlook or guidance may be incorrect; unfavorable currency exchange rates; the risks of global economic weakness or instability in global financial markets; the risks of trade restrictions, tariffs, or embargoes; the risk of breaches of our information technology systems; and other information, including the “Risk Factors” detailed from time to time in Diodes’ filings with the United States Securities and Exchange Commission.
Company Contact:Investor Relations Contact:
Diodes Inc.Shelton Group
Laura Mehrl Leanne Sievers
Director of Investor Relations President, Investor Relations
P: 972-987-3959P: 949-224-3874
E: laura_mehrl@diodes.comE: lsievers@sheltongroup.com
Exhibit 99.2
Diodes, Inc. Lite-On Semiconductor Acquisition Script
Thursday, August 8 @ 4:00pm CST / 2:00am PST
Call Participants: Diodes: Dr. Keh-Shew Lu, Rick White, Brett Whitmire, Julie Holland and Laura Mehrl
Operator:
Good morning and welcome to Diodes Incorporated’s conference call regarding its proposed acquisition of Lite-On Semiconductor Corporation. At this time, all participants are in a listen only mode. At the conclusion of today’s conference call, instructions will be given for the question and answer session. If anyone needs assistance at any time during the conference call, please press the star followed by the zero on your touchtone phone.
As a reminder, this conference call is being recorded today, Thursday, August 8, 2019. I would now like to turn the call to Shelton Group, the investor relations agency for Diodes Incorporated. Brett, please go ahead.
Introduction: Brett Perry, Vice President of Shelton GroupGood morning and thank you for joining our conference call today to discuss the proposed acquisition of Lite-On Semiconductor. I’m Brett Perry, Vice President of Shelton Group, Diodes’ investor relations firm.With us today are Diodes’ President and CEO, Dr. Keh-Shew Lu; Chief Financial Officer, Brett Whitmire; Corporate Secretary, Rick White; Vice President of Corporate Operations, Julie Holland and Director of Investor Relations, Laura Mehrl.
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If you have not yet received a copy of the press release, you can access a copy on Diodes’ website at www.diodes.com under the Investor Relations section. There is also a slide presentation that we will be using in conjunction with this call that may be accessed through the webcast link on Diodes’ website and is also posted as a PDF in the Investor Relations section.
The slide presentation and management’s statements during this conference call will include discussions of certain measures and financial information in GAAP and non-GAAP terms.
Slide 2: Safe Harbor Statement (Brett)
Before I turn the call over to Dr. Lu, I would like to remind our listeners that management’s prepared remarks contain forward-looking statements, which are subject to risks and uncertainties, and management may make additional forward-looking statements in response to your questions. These forward-looking statements include, but are not limited to, statements related to the benefits of the proposed transaction between Diodes Incorporated and Lite-On Semiconductor. These forward-looking statements are based on information available to Diodes and Lite-On Semi as of today, August 8, 2019 and current expectations, forecasts and assumptions involve a number of risks and uncertainties. Actual results may differ materially from these forward-looking statements, and therefore we refer you to a more detailed discussion of the risks and uncertainties in the Company’s filings with the Securities and Exchange Commission.
The Company claims the protection of the safe harbor for forward-looking statements that is contained in the Private Securities Litigation Reform Act of 1995, and assumes no obligation to update these projections in the future as market conditions may or may not change.
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For those of you unable to listen to the entire call at this time, a recording will be available via webcast for 60 days at the Investor Relations section of Diodes’ website at www.diodes.com.And now, it’s my pleasure to turn the call over Diodes’ President and CEO, Dr. Keh-Shew Lu.
Dr. Keh-Shew Lu, President and CEO of Diodes
Thank you, Brett. Welcome everyone, and thank you for joining us today.
We are very excited about today’s announcement regarding the proposed acquisition of Lite-On Semiconductor by Diodes. In addition to offering substantial financial synergies and an attractive rationale for the customers, employees, and shareholders of both companies, I believe this acquisition is another significant milestone on Diodes' path toward achieving our next strategic financial goal of $2.5 billion revenue and $1 billion gross profit by 2025. As we will discuss today, this transaction meets all of our acquisition criteria and will also be immediately accretive to both GAAP and non-GAAP earnings per share.
As Brett mentioned, there is a slide presentation available on our website. I have asked Julie Holland, our Vice President of Corporate Operations to review this presentation with you as part of today’s call before we open the call for your questions.
Julie Holland, Vice President, Corporate Operations
Thank you, Dr. Lu. It is my pleasure to be here today.
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Slide 3: A Strategic Combination
Diodes’ acquisition of Lite-On Semiconductor creates a company with even greater scale and a well-aligned product offering as well as the opportunity for financial and operational benefits for our long-term growth and profitability. When looking at the strengths and attributes of each company, Diodes has:
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High volume discrete, analog, logic and mixed-signal products; |
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Cost-effective wafer fabrication and packaging capabilities; |
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A strong global presence; |
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A broad product and customer base with a well-developed global sales channel; and |
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A strong base business in the consumer, computing and communications markets with an emphasis on expansion in the industrial and automotive markets. |
Lite-On Semiconductor has:
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A broad portfolio of discrete power devices, analog power ICs and hall effect devices plus a full range of contact image sensors; |
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Leading market share in bridges for ACDC applications; |
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An installed base of wafer fab and assembly capacity that is currently under-utilized; and |
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A large ownership stake in Diodes stock, holding over 15% of our outstanding shares. |
When combined, the consolidated company will offer:
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A broader footprint of discrete and protection product; |
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An expanded business base in Asia including Diodes’ participation in the contact image sensor market; |
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Access to incremental manufacturing capacity for both wafer fab and assembly; and |
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Financial value with positive impact to revenue, EBITDA and earnings per share. |
Slide 4: Lite-On Semiconductor Highlights
Let me provide an overview of Lite-On Semiconductor’s business from a corporate, manufacturing and financial perspective. As an Asia-based supplier of “green” power semiconductors specializing in discrete and analog products, Lite-On Semiconductor has an extended portfolio of product lines including rectifiers, protection products, and photo diodes, as well as power ICs and hall effect devices. In addition, Lite-On offers a full range of contact image sensors that support a wide variety of computing, industrial and financial equipment applications. Lite-On’s target markets include system power and switching power applications in the communications, information technology, and consumer electronics arena.
Lite-On Semiconductor is a publicly-held company that was established in 1990, is listed on the Taiwan stock exchange, and is headquartered in Taipei. The company has over 2300 employees, with its product development, operations, and business management teams based in Taiwan and sales offices in Taiwan, China and the US.
Lite-On Semiconductor has internal wafer fabrication plants in Hsinchu and Keelung, Taiwan and in Shanghai and Wuxi, China. Lite-On also has product packaging and test facilities in Keelung, Taiwan and in Shanghai and Wuxi, China. They offer wafer foundry and assembly subcon services to external
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customers from these manufacturing facilities as well as supporting a significant percentage of their own production requirements.
In terms of financials, Lite-On Semiconductor reported revenue of approximately $247 million US dollars in 2018 and $41 million in gross profit. Their cash and short-term investments were $91 million as of the end of 2018.
Slide 5: Transaction Rationale
Lite-On Semiconductor's business profile supports our rationale for the transaction and will benefit Diodes’ business and expand our product portfolio.
The rationale for the transaction includes:
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The extension of our overall discrete product offering with a range of rectifiers, protection products, and photo diodes, plus additional discrete power devices such as IGBTs and MOSFETs. Together, Diodes and Lite-On Semiconductor will be the world’s largest supplier of bridge products for ACDC applications, a focus market for both companies. |
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manufacturing flexibility, including more opportunities for internal dual-sourcing. |
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Financially, the transaction allows the recapture of the over 15% of DIOD shares outstanding currently held by Lite-On Semiconductor. This business combination will be immediately accretive to revenue, EBITDA, and earnings-per-share. |
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And finally, this transaction aligns with Diodes’ strategy to drive future growth through select acquisitions. We have a successful track record of integrating acquisitions, including FabTech in year 2000, Anachip and APD Semiconductor in 2006, Zetex in 2008, BCD and PAM in 2013, and Pericom in 2015. |
The terms of the acquisition include a purchase price of $NT42.50 per share for a total consideration of approximately $428 million US dollars. The acquisition is expected to close in April of 2020. The boards of both companies have approved the transaction, which is still subject to approval by Lite-On’s shareholders, as well as other customary closing conditions and regulatory approvals.
Slide 6: Lite-On Manufacturing Infrastructure
Turning now to manufacturing, the Lite-On manufacturing infrastructure includes wafer fabs in Hsinchu and Keelung, Taiwan, and in Shanghai and Wuxi, China. Lite-On runs a variety of process technologies in these wafer fabs, including a TVS process with ultra-low junction capacitance, both trench and rugged planar Schottky technology, super junction MOSFET processes up to 650V, and an IGBT technology rated to 1200V and 40A. Lite-On’s analog wafer technologies include competitive BCD, bipolar, and
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CMOS capabilities. These wafer fabs offer a combined capacity of approximately 160K 6” equivalent wafers per month.
Lite-On Semiconductor has product packaging and test facilities in Keelung, Taiwan and Shanghai and Wuxi, China. They build SMA/B/C packages as well as surface mount, through-hole, and DFN package technologies. Lite-On has combined internal assembly test capacity for over 500MU per month.
This incremental wafer fab and assembly capacity will allow Diodes additional manufacturing flexibility, and the opportunity for internal dual-sourcing across multiple locations for supply risk reduction and operational efficiencies.
Slide 7: Pro-forma Financial Overview
This transaction provides Diodes with a larger revenue base as well as the ability to drive significant increases in earnings per share due to the recapture of Lite-On’s holdings of over 15% of Diodes shares outstanding. We expect this transaction to be immediately accretive.
When looking at pro-forma results based on a calendar year for the combined company, revenue for 2Q19 would have been approximately $370 million and $1.5 billion for the trailing twelve months. Gross profit for 2Q19 would expand to approximately $128 million, with a trailing twelve month figure of nearly $500 million. Gross profit margin would decrease for the combined company based on Lite-On Semiconductor’s current manufacturing utilization. We expect the gross margin to improve as Diodes introduces additional loadings and capabilities to these facilities.
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Non-GAAP earnings per share would increase from $0.77 to $0.85 in 2Q19, and would increase to $3.29 on a trailing twelve month basis. These EPS figures include the interest cost of this transaction and the recapture of Lite-On’s holding of Diodes shares, and do not consider any additional benefit from operational synergies as a combined company.
Slide 8: Significant Step in Executing Strategic Plan
We believe that Lite-On Semiconductor represents a significant step forward in executing Diodes’ strategic growth plan to achieve $2.5 billion in revenue and $1 billion in gross profit by year 2025.
As you can see from the chart on slide 8, the combined company’s trailing twelve month revenue of $1.5B represents an implied compound annual growth rate for revenue of over 11%, suggesting that this transaction puts us well on the way to achieving our revenue growth goal.
Similarly, the progress toward our gross profit goal of $1 billion by 2025 is even more encouraging, as this transaction would allow us to reach $500M immediately on a trailing twelve month basis, with an implied compound annual growth rate that is even faster than our revenue growth trajectory.
In addition, Lite-On’s low overhead spending rates would average down our operating expense rates for R&D and SG&A, creating further favorable impact to our progress toward a goal of 20% profit from operations.
Slide 9: Diodes Strategy: Profitable Growth
To conclude, Diodes’ focus continues to be on generating profitable growth through a combination of manufacturing cost leadership, high volume end market focus, strong customer relationships, aggressive new product
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introductions, product portfolio expansion, innovative process and packaging technology as well as select strategic acquisitions. Lite-On Semiconductor is another key milestone in this growth strategy, and we look forward to the combined company’s success.
With that, we will now open the call for questions.
Q&A Session
Upon Completion of the Q&A…
Thank you to everyone for joining us today. We look forward to providing additional updates regarding the integration of Lite-On Semiconductor and the expanded opportunities for Diodes.
Operator, we may now disconnect.
Diodes to Acquire Lite-On Semiconductor August 8, 2019 LITE-ON SEMICONDUCTOR CORP. Exhibit 99.3
Any statements set forth herein that are not historical facts are forward-looking statements that involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Such forward-looking statements include, but are not limited to, the following: the expected benefits of the acquisition, including the acquisition being immediately accretive; the efficiencies, cost savings, revenues, and enhanced product offerings, market position, and design and manufacturing capabilities of Diodes after the acquisition; and other statements identified by words such as “estimates,” “expects,” “projects,” “plans,” “will,” and similar expressions. Potential risks and uncertainties include, but are not limited to, such factors as: the possibility that the transaction may not be consummated, including as a result of any of the conditions precedent; the risk of superior acquisition proposal from other parties; the risk of Diodes being unable to obtain sufficient financing from lenders to complete the acquisition; the risk of global market downturn conditions and volatilities impacting the completion of the acquisition or the funding; the risk that such expectations may not be met; the risk that the expected benefits of the acquisition may not be realized or that integration of the acquired business may not be as rapid as we anticipate; the risk that Lite-On’s business will not be integrated successfully into Diodes’; the risk that the expected benefits of the acquisition may not be realized, including the realization of the accretive effect of the acquisition; the risk that Lite-On’s standards, procedures, and controls will not be brought into conformance within Diodes’ operation; difficulties coordinating Diodes’ and Lite-On’s new product and process development, hiring additional management and other critical personnel, and increasing the scope, geographic diversity, and complexity of Diodes’ operations; difficulties in consolidating facilities and transferring processes and know-how; difficulties in reducing the cost of Lite-On’s business; the diversion of our management’s attention from the management of our business; Diodes may not be able to maintain its current growth strategy or continue to maintain its current performance, costs, and loadings in its manufacturing facilities; risks of domestic and foreign operations, including excessive operation costs, labor shortages, higher tax rates, and Diodes’ joint venture prospects; the risk that we may not be able to increase our automotive, industrial, or other revenue and market share; the risks of cyclical downturns in the semiconductor industry and of changes in end-market demand or product mix that may affect gross margin or render inventory obsolete; the risk that our future outlook or guidance may be incorrect; unfavorable currency exchange rates; the risks of global economic weakness or instability in global financial markets; the risks of trade restrictions, tariffs, or embargoes; the risk of breaches of our information technology systems; and other information, including the “Risk Factors” detailed from time to time in Diodes’ filings with the United States Securities and Exchange Commission. Safe Harbor Statement Page
TTM Revenue $230M TTM Revenue $1.26B High volume Discrete, Analog, Logic and Mixed-Signal products Cost efficient manufacturing capabilities Strong global presence Broad product and customer base 3 C's with growth focus on Automotive and Industrial Strategic Synergies Aligned Discrete and Protection Product portfolios Expanded product and revenue footprint in Asia Operating and administrative efficiencies Incremental wafer fab and assembly capacity Immediately accretive to revenue, EBITDA and GAAP EPS Combined Company TTM Revenue $1.5B + = A Strategic Combination Contact Image Sensors, Rectifiers, Protection Products, Photo Diodes, and Hall Effect ICs World’s largest supplier of general purpose bridge products for AC-DC Under-utilized wafer fabs and assembly test facilities 15.3% ownership of DIOD shares Page LITE-ON SEMICONDUCTOR CORP.
Lite-On Semiconductor Highlights Business Overview Financial Overview Corporate Overview Manufacturing Overview Asia-based semiconductor supplier specializing in “green” power-related Analog and Discrete devices Focus on Power Discretes, including rectifiers and TVS Full range of contact image sensors for computing applications Established in 1990; publically listed (TWSE: 5305) Headquartered in Taipei, Taiwan 2300 employees across Taiwan and China In-house wafer fabs and assembly/test manufacturing in Taiwan and China Wafer and module foundry services for a range of proven technologies including bipolar and high voltage CMOS 2018 Revenues of $247 million USD ($30 NTD = $1 USD) 2018 Gross Profit of $41 million USD 2018 Cash and short-term investments of $91 million Page
Aligned Product Offering Growth and Integration Opportunities Enhanced Scale Aligned Discrete product portfolios: Rectifiers, Protection Products, Photo Diodes Creates world’s largest supplier of general purpose bridge products for AC-DC applications Potential profitability improvement through operating and manufacturing efficiencies Expanded customer and market presence for acquired products through Diodes’ extensive sales network and channel Opportunity to leverage LSC’s manufacturing footprint to expand sourcing options Accelerates repurchase of Diodes shares outstanding Immediately accretive to revenue, EBITDA and GAAP EPS Transaction Rationale Financial Leverage Consistent with Diodes' strategy to drive growth through select acquisitions Successful track record of revenue expansion, cost reduction, and business rationalization: FabTech in 2000, Anachip and APD in 2006, Zetex in 2008, BCD and PAM in 2013, Pericom in 2015 Page
Page Lite-On Manufacturing Infrastructure Hsinchu, Taiwan Wafer Fab 25K 6” wafers per month Bipolar, BCD, CMOS Processes Merged 2005 Wuxi, China Wafer Fab 190K 4” wafers per month GPP Processes Opened 2004 Shanghai, China Wafer Fab 110K 3” wafers per month GPP Processes Opened 1993 Keelung, Taiwan Wafer Fab 58K 3” wafers per month Thyristor, TVS, SF Processes Opened 1990 Wuxi, China Assembly Site 177KK Units per month DIP, TO, SMD, DFN Packages Opened 2005 Shanghai, China Assembly Site 370KK Units per month SMA / SMB / SMC Packages Opened 1993 Keelung, Taiwan Assembly Site 7KK Units per month SMD Packages Opened 1990
Page Pro-Forma Financial Overview Large revenue base with $1.5B annual combined revenue Immediately accretive to non-GAAP EPS Recapture LSC’s holding of 15.3% of DIOD shares Note: All dates reflect calendar quarter Combined Company (1) (2) (1) Intercompany revenue is eliminated (2) Includes the interest cost of this transaction and the reduction in Diodes shares
Significant Step in Executing Strategic Plan Page *Represents pro-forma trailing twelve months for Diodes and Lite-On results combined 2017 TTM 2Q19* Goal 2025 Implied CAGR Revenue $1.05B $1.5B $2.5B 11.4% GP% 33.8% 34.0% 40% GP$ $357M $500M $1B 13.8% R&D% 7.4% 6.6% 7% SG&A% 15.9% 14.8% 13% Operating Profit 7.5% 12.6% 20% Page
Diodes Strategy: Profitability Growth Page Lite-On Semiconductor is another key milestone
Thank you Company Contact: Diodes Incorporated Laura Mehrl Director of Investor Relations P: 972-987-3959 E: laura_mehrl@diodes.com Investor Relations Contact: Shelton Group Leanne K. Sievers EVP, Investor Relations P: 949-224-3874 E: lsievers@diodes.com www.diodes.com