DALLAS--(BUSINESS WIRE)--Oct. 14, 2009--
Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and
supplier of high-quality application specific standard products within
the broad discrete and analog semiconductor markets, has introduced
high-current rectifiers with an ultra-low forward voltage (VF) drop.
These rectifiers are targeted at power supply designers for use in
consumer and industrial applications such as ultra-slim, end-user
products, which include the following: laptop and netbook adapters,
LED/LCD TVs, and telecom server power supplies where low profile height
and efficiency are critical.
Diodes’ PDR5K is the industry’s first 5A/750V rectifier in a PowerDI®5
package. In a compact, low-profile solution, the PDR5K offers reduction
in profile height up to 17 times compared to the height of the standard
larger, bulkier bridge packages that are used in offline AC/DC Switch
Mode Power Supplies (SMPS). The PowerDI®5 package has a low
profile package height of just 1.15mm, offering the opportunity to
reduce the total form factor of the end product. The PDR5K was designed
in collaboration with Vicor Corporation of Andover, Massachusetts, a
leading company in switched mode power supplies, to meet its power and
space constraint application requirements.
“The introduction of the PDR5K extends Diodes’ leadership position as a
company that is committed to working closely with customers to deliver
new innovative products that meet the demands of the marketplace,”
remarks Mark King, Diodes’ Senior Vice President of Sales and Marketing.
“The PDR5K has already received very strong customer acceptance.”
In addition, Diodes is releasing a new family of 40A Ultra-low VF SBR®
rectifiers in a low profile TO-262 package designed to be used as output
rectifiers for SMPS devices. Using the Company’s patented SBR®
technology, the SBR40U60CTE, SBR40U100CTE, and SBR40U120CTE offer
ultra-low VF performance that reduces power loss for cooler operation
and higher efficiency. The TO-262’s package height is 31.1% lower in
profile height compared to a standard TO-220 package.
Combining both products in a single SMPS device, the PDR5K in the
primary and the SBR40UxxxCTE as output rectifiers in flyback or forward
converters on the secondary side, the total solution offers the lowest
package profile height with the highest efficiency.
Both the PowerDI®5 and TO-262 packages are built using
‘green’ antimony and bromine-free mold compound that is RoHS compliant,
underpinning Diode’s continual commitment to manufacturing environmental
friendly products.
PowerDI and SBR are registered trademarks of Diodes Incorporated.
About Vicor Corporation
Vicor Corporation designs, develops, manufactures and markets modular
power components and complete power systems based upon a portfolio of
patented technologies. Headquartered in Andover, Massachusetts, Vicor
sells its products primarily to the communications, information
technology, industrial control and military electronics markets.
About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard & Poor’s SmallCap 600 and
Russell 3000 Index company, is a leading global manufacturer and
supplier of high-quality application specific standard products within
the broad discrete and analog semiconductor markets, serving the
consumer electronics, computing, communications, industrial and
automotive markets. Diodes' products include diodes, rectifiers,
transistors, MOSFETs, protection devices, functional specific arrays,
amplifiers and comparators, Hall-effect sensors and temperature sensors,
power management devices including LED drivers, DC-DC switching
regulators, linear voltage regulators and voltage references, along with
special function devices including USB power switch, load switch,
voltage supervisor and motor controllers. The Company’s corporate
headquarters is located in Dallas, Texas. A sales, marketing,
engineering and logistics office is located in Westlake Village,
California. Design centers are located in Dallas; San Jose, California;
Taipei, Taiwan; Manchester, England and Neuhaus, Germany. The Company’s
wafer fabrication facilities are located in Kansas City, Missouri and
Manchester; with two manufacturing facilities located in Shanghai,
China, another in Neuhaus, and a joint venture facility located in
Chengdu, China. Additional engineering, sales, warehouse and logistics
offices are located in Taipei; Hong Kong; Manchester and Munich,
Germany, with support offices located throughout the world. For further
information, including SEC filings, visit the Company's website at http://www.diodes.com.
Source: Diodes Incorporated
Company Contact:
Diodes Incorporated
Francis Tang, VP,
Product Development
P: 972-385-2810
E: pressinquiries@diodes.com
or
Investor
Contact:
Shelton Group
Leanne K. Sievers, EVP, Investor
Relations
P: 949-224-3874
E: lsievers@sheltongroup.com