PLANO, Texas--(BUSINESS WIRE)--Mar. 13, 2012-- Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today announced its first products to be housed in the ultra-miniature X3-DFN0603-2 package. The company's first 6.0V Zener and switching diodes to be provided in the 0.6mm x 0.3mm x 0.3mm format take 70% less PCB space than DFN1006-2 packaged alternatives and have an off-board height 40% lower.
Meeting increasing demand for component miniaturization in lightweight portable products such as tablets and mobile handsets, the X3-DFN0603-2 package will also help increase efficiency, with its thermally efficient design achieving 250mW power dissipation and improve electrical performance, through reduced lead inductance.
Diodes Incorporated has initially introduced a series of seven low-leakage Zeners in the miniature package, suitable for voltage referencing, regulation, over-voltage protection and voltage-limiting applications. The 'GDZ' Zeners offer nominal voltages from 5.1V through to 8.2V with a commendable ±5% Vz tolerance.
Also introduced in the miniature package at this time are two low capacitance (CT≤3pF) 85V rated switching diodes. The 1SS361LP3 is characterized by fast-switching performance (tRR≤4ns), while the BSA116LP3's low-leakage current (IR≤10nA) helps extend battery life. For further information, visit the Company's website at http://www.diodes.com.
About Diodes Incorporated
Diodes Incorporated (Nasdaq: DIOD), a Standard and Poor's SmallCap 600 and Russell 3000 Index company, is a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Diodes' products include diodes, rectifiers, transistors, MOSFETs, protection devices, functional specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors; power management devices, including LED drivers, DC-DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. The Company's corporate headquarters, logistics center, and Americas' sales office are located in Plano, Texas. Design, marketing, and engineering centers are located in Plano; San Jose, California; Taipei, Taiwan; Manchester, England; and Neuhaus, Germany. The Company's wafer fabrication facilities are located in Kansas City, Missouri and Manchester, with two manufacturing facilities located in Shanghai, China, another in Neuhaus, and two joint venture facilities located in Chengdu, China. Additional engineering, sales, warehouse, and logistics offices are located in Fort Worth, Texas; Taipei; Hong Kong; Manchester; and Munich, Germany, with support offices located throughout the world. For further information, including SEC filings, visit the Company's website at http://www.diodes.com.
Source: Diodes Incorporated
Company Contact:
Diodes Incorporated
Francis Tang
VP, Worldwide Discrete Products
P: 972-987-3900
E: pressinquiries@diodes.com
or
Investor Relations Contact:
Shelton Group
Leanne K. Sievers
EVP, Investor Relations
P: 949-224-3874
E: lsievers@sheltongroup.com
